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E-TDA7313NDTR

STMicroelectronics

E-TDA7313NDTR by STMicroelectronics

E-TDA7313NDTR by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 103 dB channel separation, 0.09% harmonic distortion, and operates b/w -40 °C to 85°C. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Inventory MP

USA . 2,511 parts In-Stock

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Vyrian

USA . 1,952 parts In-Stock

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Anansix

USA . 1,637 parts In-Stock

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Digiode

USA . 596 parts In-Stock

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IDEA Electronic Components Group

UK . 1,736 parts In-Stock

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$2.917

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$2.626

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$2.917

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$2.626

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MKK Technologies

India . 1,524 parts In-Stock

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$5.486

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$5.486

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DigiPath Technology Company

USA . 1,524 parts In-Stock

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$5.486

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$5.486

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Native Components

USA . 573 parts In-Stock

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$198.530

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$190.589

573

$198.530

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$190.589

Northwest PG Solutions

USA . 859 parts In-Stock

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$218.383

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Parana Technologies

USA . 2,026 parts In-Stock

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$3.488

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$3.488

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Corphita

USA . 984 parts In-Stock

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984

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 28 parts In-Stock

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Overview

Elevate your audio experience with the E-TDA7313NDTR from STMicroelectronics, a leader in innovation. This premium audio control IC delivers exceptional sound quality and remarkable channel separation, perfect for high-end audio applications. Designed for versatility and reliability, it thrives in demanding environments while offering seamless integration in compact designs. Trust in STMicroelectronics for cutting-edge technology that enhances performance, ensuring your projects resonate with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making it suitable for a range of applications.

Surface Mount: YES

Surface mount capability allows for easier and faster manufacturing processes, as well as saving PCB space.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout on PCB designs and optimizes space utilization.

General IC Type: TONE CONTROL CIRCUIT

Designed specifically for tone control, this IC provides enhanced audio quality, making it ideal for audio applications.

Channel Separation: 103 dB

A high channel separation value minimizes crosstalk, ensuring clearer sound reproduction and better overall audio performance.

Harmonic Distortion: 0.09%

With low harmonic distortion, this IC maintains audio integrity, delivering pure and accurate sound.

No. of Terminals: 28

Having 28 terminals allows for multiple connections, providing versatility for various audio circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is compact, making it suitable for tight spaces on printed circuit boards.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is capable of functioning in relatively high thermal environments.

No. of Bands: 2

Having 2 bands allows for precise control over audio frequencies, enhancing overall sound quality.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, this IC can operate reliably in extreme conditions.

Terminal Position: DUAL

The dual terminal position enhances design flexibility and accommodates various circuit layouts.

Maximum Seated Height: 2.65 mm

The low profile height allows for integration into space-constrained applications easily.

Width: 7.5 mm

A width of 7.5 mm provides a compact footprint, making it suitable for designs needing space efficiency.

Minimum Supply Voltage (Vsup): 6 V

The ability to operate at a minimum supply voltage of 6 V makes it compatible with various standard power supplies.

Length: 17.9 mm

At 17.9 mm in length, the compact size aids in efficient PCB layout and device integration.

Temperature Grade: INDUSTRIAL

Being temperature graded for industrial applications ensures reliability and performance in demanding environments.

No. of Channels: 2

Supporting 2 channels enables stereophonic audio processing, improving the listening experience.

Technology: BICMOS

BICMOS technology combines the advantages of both Bipolar and CMOS processes, resulting in efficient performance and lower power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and reduce the risk of damage during mounting.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of handling during assembly.

Maximum Supply Voltage (Vsup): 10 V

With a maximum supply voltage of 10 V, this IC is versatile enough to accommodate a range of power configurations.

Technical Specifications

Audio Control ICs E-TDA7313NDTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.09 %

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7313NDTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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