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TDA7438D

STMicroelectronics

TDA7438D by STMicroelectronics

TDA7438D by STMicroelectronics is an Audio Control IC with 100 dB Channel Separation, 0.01% Harmonic Distortion, and 3 Tone Control Bands. It is a BICMOS technology chip in a small outline package used for tone control circuits in audio applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,491 parts In-Stock

1+ parts

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8,491

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ComSIT Distribution GmbH

Germany . 2,704 parts In-Stock

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2,704

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ComSIT USA

USA . 2,592 parts In-Stock

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2,592

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Anansix

USA . 1,768 parts In-Stock

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1,768

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Digiode

USA . 1,286 parts In-Stock

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1,286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,919 parts In-Stock

1+ parts

$2.047

100+ parts

-

1k+ parts

$1.842

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1,919

$2.047

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$1.842

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MKK Technologies

India . 1,926 parts In-Stock

1+ parts

$3.849

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1,926

$3.849

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DigiPath Technology Company

USA . 1,926 parts In-Stock

1+ parts

$3.849

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1,926

$3.849

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Microchip USA

USA . 349 parts In-Stock

1+ parts

$4.823

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349

$4.823

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AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$19.400

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813

$19.400

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A-Z Elektronik GmbH

Germany . 6,821 parts In-Stock

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6,821

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Corphita

USA . 2,986 parts In-Stock

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2,986

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Kepictronics

USA . 1,190 parts In-Stock

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1,190

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Parana Technologies

USA . 540 parts In-Stock

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$2.448

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540

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$2.448

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Overview

Elevate your audio experience with the TDA7438D by STMicroelectronics, a top-of-the-line Audio Control IC that promises unparalleled quality and performance. Crafted by one of the leading manufacturers in the industry, this product boasts superior channel separation and minimal harmonic distortion, ensuring crystal-clear sound. Perfect for tone control circuits, this small outline package is designed for easy installation and maximum efficiency. Upgrade your sound system today with the TDA7438D and immerse yourself in a world of high-quality audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio output from each channel, providing an immersive listening experience.

Harmonic Distortion: 0.01%

Low harmonic distortion results in clean and accurate sound reproduction without any unwanted noise or interference.

Power Supplies (V): 9

Operating at 9 volts provides a stable power source for the IC, ensuring consistent performance and reliability.

Temperature Grade: COMMERCIAL

Being rated for commercial use, this IC is designed to handle typical environmental conditions, making it suitable for a wide range of applications.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of BiCMOS and CMOS technologies, offering high-speed performance and low power consumption.

Technical Specifications

Audio Control ICs TDA7438D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7438D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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