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LV3329PE-TLM-H

Onsemi

LV3329PE-TLM-H by Onsemi

LV3329PE-TLM-H by Onsemi is a 44-terminal audio control IC with 80 dB channel separation and 0.01% harmonic distortion. Ideal for tone control circuits, it operates b/w -40 to 85 °C, featuring a BIMOS technology and quad terminal position.

Median Price

$6.590

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$5.690

1k+ parts

$5.090

10k+ parts

$4.790

10,000

-

$5.690

$5.090

$4.790

DigiKey

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$6.590

1k+ parts

-

10k+ parts

-

10,000

-

$6.590

-

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$7.112

1k+ parts

$6.362

10k+ parts

-

6,000

-

$7.112

$6.362

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 535 parts In-Stock

1+ parts

$5.200

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$5.200

-

-

-

Digiode

USA . 2,005 parts In-Stock

1+ parts

$6.023

100+ parts

-

1k+ parts

-

10k+ parts

-

2,005

$6.023

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 175 parts In-Stock

1+ parts

$5.200

100+ parts

-

1k+ parts

-

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175

$5.200

-

-

-

Corphita

USA . 257 parts In-Stock

1+ parts

$5.706

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$5.706

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,765 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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22,765

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-

-

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Continental Prestige Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.900

10k+ parts

-

10,000

-

-

$4.900

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Kulean Microsystems

USA . 5,795 parts In-Stock

1+ parts

-

100+ parts

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5,795

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Problanco Electronics

Mexico . 3,408 parts In-Stock

1+ parts

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3,408

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SupplyDigital Components

Austria . 2,849 parts In-Stock

1+ parts

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100+ parts

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2,849

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TANS Electronics

Latvia . 1,987 parts In-Stock

1+ parts

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1,987

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Microchip USA

USA . 371 parts In-Stock

1+ parts

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371

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UHIMA Technologies

Türkiye . 221 parts In-Stock

1+ parts

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100+ parts

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221

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Overview

Elevate your audio experience with the LV3329PE-TLM-H by Onsemi. Crafted with precision and expertise, this audio control IC guarantees top-notch quality and unparalleled performance. Ideal for tone control circuits, this IC offers superior channel separation and minimal harmonic distortion, ensuring crystal clear sound in every application. With a robust package body material, surface mount capability, and a wide operating temperature range, this product is designed to exceed expectations. Upgrade your audio systems today with the LV3329PE-TLM-H and enjoy the ultimate audio perfection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and commonly used in electronic components, ensuring the product's longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly in electronic devices, saving space and making integration simpler.

General IC Type: TONE CONTROL CIRCUIT

This specific IC type is designed for tone control, making it ideal for audio applications where precise control over sound frequencies is needed.

Channel Separation: 80 dB

High channel separation of 80 dB ensures that each channel operates independently without interference, resulting in clear and crisp audio output.

Harmonic Distortion: 0.01 %

Low harmonic distortion of 0.01% means that the audio signals passing through this IC will be reproduced accurately without any unwanted noise or distortion.

No. of Terminals: 44

Having a higher number of terminals allows for more connectivity options, making it versatile for different audio control applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design, making it suitable for smaller electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand elevated temperatures in industrial settings without compromising performance.

No. of Bands: 3

Having 3 bands allows for more precise tone control adjustments, catering to a wider range of audio preferences and requirements.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the IC can function reliably even in extreme cold environments.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides good solderability and corrosion resistance, ensuring a reliable and long-lasting connection.

Technology: BIMOS

The BIMOS technology combines the advantages of bipolar and CMOS technologies, offering high performance and low power consumption for efficient operation.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC can withstand moderate exposure to moisture during storage and handling, maintaining its reliability.

Maximum Supply Voltage (Vsup): 9 V

The high maximum supply voltage of 9 volts allows for flexibility in power input, accommodating a wide range of audio control applications.

Technical Specifications

Audio Control ICs LV3329PE-TLM-H attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

Channel Separation:

80 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e6

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.8 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LV3329PE-TLM-H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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