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LV3319PM-TLM-E

Onsemi

LV3319PM-TLM-E by Onsemi

LV3319PM-TLM-E by Onsemi is a Tone Control Circuit IC with 44 terminals, operating at -40 to 85 °C. It has a power supply of 9V and uses BICMOS technology. Ideal for audio applications, this surface-mount IC in a square package offers precise tone control in industrial settings.

Median Price

$3.470

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 59,947 parts In-Stock

1+ parts

-

100+ parts

$2.990

1k+ parts

$2.680

10k+ parts

$2.520

59,947

-

$2.990

$2.680

$2.520

DigiKey

USA . 59,947 parts In-Stock

1+ parts

-

100+ parts

$3.470

1k+ parts

$3.470

10k+ parts

$3.470

59,947

-

$3.470

$3.470

$3.470

Verical

USA . 31,000 parts In-Stock

1+ parts

-

100+ parts

$3.938

1k+ parts

$3.350

10k+ parts

$3.150

31,000

-

$3.938

$3.350

$3.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,383 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

2,383

$2.740

-

-

-

Digiode

USA . 1,398 parts In-Stock

1+ parts

$3.173

100+ parts

-

1k+ parts

-

10k+ parts

-

1,398

$3.173

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 358 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$2.740

-

-

-

Corphita

USA . 1,068 parts In-Stock

1+ parts

$3.006

100+ parts

-

1k+ parts

-

10k+ parts

-

1,068

$3.006

-

-

-

Continental Prestige Electronics

USA . 59,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.580

10k+ parts

-

59,947

-

-

$2.580

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,018

-

-

-

-

Microchip USA

USA . 6,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,892

-

-

-

-

TANS Electronics

Latvia . 4,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,955

-

-

-

-

Problanco Electronics

Mexico . 4,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,597

-

-

-

-

Perfect Parts

USA . 3,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,004

-

-

-

-

Kulean Microsystems

USA . 2,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,283

-

-

-

-

SupplyDigital Components

Austria . 977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

977

-

-

-

-

UHIMA Technologies

Türkiye . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

660

-

-

-

-

Overview

Enhance your audio experience with the LV3319PM-TLM-E by Onsemi, a top-of-the-line audio control IC that promises superior quality and reliability. Onsemi is renowned for its cutting-edge technology and innovative solutions in the industry. This tone control circuit offers unmatched performance and precision, making it ideal for a wide range of applications. Elevate your sound system with this product and enjoy crystal-clear audio like never before. Experience the value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape offers easy handling and orientation during assembly, reducing the chance of errors.

General IC Type: TONE CONTROL CIRCUIT

Tone control circuit functionality enables precise adjustment of audio frequencies, enhancing sound quality and customization options.

Power Supplies (V): 9

Operating at 9V provides sufficient power for the IC to function optimally in various audio control applications.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and integration with other components in the audio system.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact form factor, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can maintain stability and performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows for reliable functionality in cold temperature conditions, expanding the product's usability range.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish offers good solderability and resistance to corrosion, ensuring robust connections for long-term use.

Terminal Position: QUAD

Quad terminal position enables easy and secure mounting on circuit boards, enhancing overall reliability and stability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the IC can withstand harsh operating conditions and maintain consistent performance.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during assembly, streamlining the manufacturing process.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the IC allows for precise alignment and placement on the circuit board, reducing the risk of errors.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the IC can withstand exposure to moisture during storage and assembly, ensuring reliability and performance in various environments.

Technical Specifications

Audio Control ICs LV3319PM-TLM-E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LV3319PM-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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