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LV3313PM-TLM-E

Onsemi

LV3313PM-TLM-E by Onsemi

LV3313PM-TLM-E by Onsemi is a BICMOS audio control IC with 44 terminals in a square flatpack package. It operates b/w -40 to 85 °C, drawing a max of 23mA at 8V. Ideal for tone control circuits in industrial applications due to its quad terminal position and moisture sensitivity level of MSL3.

Median Price

$1.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34,344 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.680

10k+ parts

$1.580

34,344

-

$1.880

$1.680

$1.580

Verical

USA . 30,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.100

10k+ parts

$1.975

30,970

-

-

$2.100

$1.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,335 parts In-Stock

1+ parts

$1.976

100+ parts

-

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1,335

$1.976

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-

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Vyrian

USA . 7,097 parts In-Stock

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7,097

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 314 parts In-Stock

1+ parts

$1.710

100+ parts

-

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314

$1.710

-

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Corphita

USA . 1,573 parts In-Stock

1+ parts

$1.872

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-

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1,573

$1.872

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-

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$4.366

100+ parts

$4.322

1k+ parts

$4.148

10k+ parts

-

300

$4.366

$4.322

$4.148

-

AZTECH Wire

Italy . 1,029 parts In-Stock

1+ parts

$19.640

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1,029

$19.640

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Continental Prestige Electronics

USA . 34,354 parts In-Stock

1+ parts

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100+ parts

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$1.610

10k+ parts

-

34,354

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$1.610

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QUARKTWIN TECHNOLOGY LTD

USA . 29,388 parts In-Stock

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29,388

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Problanco Electronics

Mexico . 7,541 parts In-Stock

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7,541

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SupplyDigital Components

Austria . 4,179 parts In-Stock

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4,179

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Microchip USA

USA . 4,032 parts In-Stock

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4,032

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TANS Electronics

Latvia . 3,766 parts In-Stock

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3,766

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 1,650 parts In-Stock

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1,650

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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1,100

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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552

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Kulean Microsystems

USA . 513 parts In-Stock

1+ parts

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513

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Overview

Elevate your audio experience with the LV3313PM-TLM-E by Onsemi. Crafted with precision and quality in mind, this audio control IC offers unmatched performance and reliability. Perfect for a wide range of applications, this tone control circuit delivers superior sound customization capabilities. With cutting-edge technology and industrial-grade components, this product ensures optimal functionality in any environment. Say hello to enhanced audio quality and seamless integration with the LV3313PM-TLM-E. Elevate your audio experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good insulation and protection for the IC, making it durable and reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and making it suitable for automated assembly processes.

Power Supplies (V): 8

Operating at 8V allows for compatibility with a wide range of power sources, making it versatile for various applications.

Package Style (Meter): FLATPACK

The flatpack package style optimizes space utilization on circuit boards and enhances thermal performance, improving overall efficiency.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Audio Control ICs LV3313PM-TLM-E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

23 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV3313PM-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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