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TDA7719

STMicroelectronics

TDA7719 by STMicroelectronics

TDA7719 by STMicroelectronics is a BICMOS audio control IC with 2 channels, offering tone control circuitry and 3 bands. It features 90 dB channel separation, operates b/w -40 to 85°C, and requires power supplies of 7.5-10V. Ideal for industrial applications requiring precise audio adjustments in compact spaces.

Median Price

$3.245

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 724 parts In-Stock

1+ parts

$2.900

100+ parts

$2.140

1k+ parts

$1.920

10k+ parts

-

724

$2.900

$2.140

$1.920

-

DigiKey

USA . 241 parts In-Stock

1+ parts

$3.590

100+ parts

$2.241

1k+ parts

-

10k+ parts

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241

$3.590

$2.241

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.310

100+ parts

-

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-

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50

$2.310

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Digiode

USA . 3,599 parts In-Stock

1+ parts

$2.755

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-

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3,599

$2.755

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Vyrian

USA . 7,697 parts In-Stock

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-

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7,697

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Anansix

USA . 469 parts In-Stock

1+ parts

-

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469

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LIBRA Elektronik GmbH

Germany . 460 parts In-Stock

1+ parts

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460

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LWI Electronics Inc

India . 6 parts In-Stock

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6

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$1.639

100+ parts

-

1k+ parts

$1.475

10k+ parts

-

41

$1.639

-

$1.475

-

Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$2.460

100+ parts

-

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242

$2.460

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Corphita

USA . 2,607 parts In-Stock

1+ parts

$2.610

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2,607

$2.610

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MKK Technologies

India . 1,775 parts In-Stock

1+ parts

$3.081

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1,775

$3.081

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DigiPath Technology Company

USA . 1,775 parts In-Stock

1+ parts

$3.081

100+ parts

-

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1,775

$3.081

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RC Electronics

USA . 39,439 parts In-Stock

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39,439

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Lixinc

USA . 18,932 parts In-Stock

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18,932

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Epart123

USA . 8,000 parts In-Stock

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8,000

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Perfect Parts

USA . 1,926 parts In-Stock

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1,926

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A-Z Elektronik GmbH

Germany . 1,805 parts In-Stock

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1,805

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Parana Technologies

USA . 1,782 parts In-Stock

1+ parts

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$1.959

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1,782

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$1.959

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Authorized Procurement Solutions

USA . 1,716 parts In-Stock

1+ parts

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1,716

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Kepictronics

USA . 1,550 parts In-Stock

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1,550

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your audio experience with the TDA7719 by STMicroelectronics. Crafted with precision and expertise, this Audio Control IC offers unparalleled sound quality and performance. Perfect for applications in automotive and home audio systems, this tone control circuit provides crystal-clear audio with 90 dB channel separation. With a compact design and reliable construction, the TDA7719 guarantees an immersive listening experience. Elevate your sound system today with the exceptional value and benefits that this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the IC, making it suitable for various applications.

Surface Mount: YES

Simplifies the assembly process and allows for easy integration onto circuit boards.

Channel Separation: 90 dB

Ensures clear and distinct separation of audio channels, resulting in high-quality sound output.

Power Supplies (V): 8.5

Works efficiently with a power supply of 8.5 volts, allowing for optimal performance.

No. of Terminals: 28

Provides ample connectivity options for various inputs and outputs, enhancing versatility.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it reliable in different environmental conditions.

No. of Bands: 3

Offers flexibility in adjusting and controlling different frequency bands for desired audio output.

Minimum Operating Temperature: -40 °C

Can function effectively in low-temperature environments, guaranteeing consistent performance.

Terminal Finish: MATTE TIN

Ensures good electrical conductivity and reliable connections for long-term use.

Maximum Seated Height: 1.2 mm

Compact design with a low profile height for space-saving installation in electronic devices.

No. of Channels: 2

Supports dual audio channels, ideal for stereo sound systems and applications.

Technology: BICMOS

Utilizes BICMOS technology for efficient operation and integration of both bipolar and CMOS components.

Technical Specifications

Audio Control ICs TDA7719 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

8.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TDA7719 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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