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LV3328PM-MPB-E

Onsemi

LV3328PM-MPB-E by Onsemi

LV3328PM-MPB-E by Onsemi is an Audio Control IC with 44 terminals, operating at -40 to 85 °C. It features a 9V power supply, BICMOS technology, and GULL WING terminals. Ideal for industrial applications requiring precise audio control in a compact SQUARE package.

Median Price

$2.538

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 264 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

264

-

$2.030

$1.820

$1.710

DigiKey

USA . 264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.680

10k+ parts

-

264

-

-

$2.680

-

Verical

USA . 264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.538

10k+ parts

-

264

-

-

$2.538

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 649 parts In-Stock

1+ parts

$2.147

100+ parts

-

1k+ parts

-

10k+ parts

-

649

$2.147

-

-

-

Vyrian

USA . 5,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,734

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 63 parts In-Stock

1+ parts

$1.860

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$1.860

-

-

-

Corphita

USA . 2,500 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$2.034

-

-

-

TANS Electronics

Latvia . 8,156 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,156

-

-

-

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SupplyDigital Components

Austria . 2,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,221

-

-

-

-

Kulean Microsystems

USA . 2,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,115

-

-

-

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Problanco Electronics

Mexico . 412 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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412

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-

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UHIMA Technologies

Türkiye . 284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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284

-

-

-

-

Continental Prestige Electronics

USA . 264 parts In-Stock

1+ parts

-

100+ parts

$3.190

1k+ parts

-

10k+ parts

-

264

-

$3.190

-

-

Overview

Experience top-notch audio control with the LV3328PM-MPB-E by Onsemi. Crafted with precision and quality, this product is designed to exceed your expectations in performance and reliability. With a sleek package body material of plastic/epoxy and surface mount capability, this audio control IC is versatile and adaptable for a wide range of applications. Whether you're looking to enhance your sound system or optimize your audio controls, this product offers exceptional value, benefits, and advantages that will elevate your listening experience to the next level. Trust in Onsemi's expertise and innovation to deliver excellence in audio control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and thermal properties, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Power Supplies (V): 9

Operating at 9V allows for compatibility with a wide range of audio equipment, making this control IC versatile and adaptable.

No. of Terminals: 44

Having a high number of terminals enables the control IC to handle more functions and connections, providing enhanced control capabilities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the control IC can withstand elevated temperatures without risking damage, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

The control IC can operate even in extremely low temperatures, making it suitable for applications in harsh environments or climates.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth finish offers good solderability and corrosion resistance, ensuring strong and stable connections for improved performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption, making the control IC efficient and reliable.

Technical Specifications

Audio Control ICs LV3328PM-MPB-E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LV3328PM-MPB-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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