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LC75411WS

Onsemi

LC75411WS by Onsemi

LC75411WS by Onsemi is a CMOS Audio Control IC with 48 terminals in a square flatpack package. It operates b/w -40 °C to 85°C, requiring a 9V power supply and drawing a max current of 40mA. Ideal for industrial applications needing precise audio control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,615 parts In-Stock

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Vyrian

USA . 1,454 parts In-Stock

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1,454

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SupplyDigital Components

Austria . 6,899 parts In-Stock

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6,899

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Problanco Electronics

Mexico . 6,160 parts In-Stock

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TANS Electronics

Latvia . 3,007 parts In-Stock

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Kulean Microsystems

USA . 1,844 parts In-Stock

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Corphita

USA . 933 parts In-Stock

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UHIMA Technologies

Türkiye . 723 parts In-Stock

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723

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Corohmni

South Africa . 436 parts In-Stock

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Overview

Experience crystal clear sound like never before with the LC75411WS from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Audio Control ICs that are perfect for a wide range of applications. Whether you're looking to enhance your home entertainment system or improve the audio quality in your car, this product offers unmatched value and benefits. Trust Onsemi to provide innovative solutions that elevate your audio experience to new heights. Choose the LC75411WS and immerse yourself in premium sound quality today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and flexible integration into various electronic devices.

Package Shape: SQUARE

The square package shape makes it easier to handle and fit into compact spaces within circuit designs.

Power Supplies (V): 9

Operating at a voltage of 9V offers a good balance between power consumption and performance for audio control applications.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for input and output signals, enabling versatile audio control functionalities.

Package Style (Meter): FLATPACK

The flatpack style offers a low-profile design, saving space and enhancing the product's overall efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliable functionality in extreme cold conditions.

Terminal Position: QUAD

Having a quad terminal position provides a secure and stable connection for improved signal transmission.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets the rigorous temperature and reliability standards required in harsh environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and increased speed, optimizing the product's performance in audio control tasks.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and rework processes, enhancing the overall reliability and manufacturability of the product.

Maximum Supply Current: 40 mA

Operating at a maximum supply current of 40 mA ensures efficient power usage while maintaining stable audio control operations.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product offers precise and compact terminal spacing for optimized circuit design and connectivity.

Technical Specifications

Audio Control ICs LC75411WS attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

40 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75411WS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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