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LC75410E

Onsemi

LC75410E by Onsemi

LC75410E by Onsemi is an Audio Control IC with 64 terminals in a square flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It operates at 9V power supply and consumes a max of 45mA, making it ideal for audio applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,151 parts In-Stock

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Vyrian

USA . 2,004 parts In-Stock

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2,004

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Kulean Microsystems

USA . 7,938 parts In-Stock

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TANS Electronics

Latvia . 7,613 parts In-Stock

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Problanco Electronics

Mexico . 6,406 parts In-Stock

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Corphita

USA . 1,957 parts In-Stock

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SupplyDigital Components

Austria . 1,004 parts In-Stock

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UHIMA Technologies

Türkiye . 616 parts In-Stock

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616

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Corohmni

South Africa . 488 parts In-Stock

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Overview

Enhance your audio control systems with the LC75410E by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for various applications in the audio industry. The LC75410E, a versatile Audio Control IC, offers customers the value of exceptional performance and durability. With its advanced technology and industrial-grade temperature range, this product ensures optimal functionality and longevity. Upgrade your audio systems with the LC75410E and experience the benefits of superior sound control and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Squares are compact and space-efficient, making the IC suitable for applications where board space is limited.

Power Supplies (V): 9

Operating at 9V allows for compatibility with a wide range of systems and applications.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and functionality in the circuit.

Package Style (Meter): FLATPACK

Flatpack style is conducive to good heat dissipation and efficient power management, improving overall performance.

Maximum Operating Temperature: 85 °C

Can perform reliably in high-temperature environments without risk of overheating or damage.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections, reducing the risk of signal loss or interference.

Temperature Grade: INDUSTRIAL

Designed to withstand rigorous industrial conditions and temperature fluctuations, ensuring consistent performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise tolerance, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide a strong mechanical bond, enhancing the overall durability of the IC.

Maximum Supply Current: 45 mA

With a maximum supply current of 45mA, the IC can effectively operate within the specified power limits.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting, making it ideal for space-constrained applications.

Technical Specifications

Audio Control ICs LC75410E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

45 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC75410E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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