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LC75281E

Onsemi

LC75281E by Onsemi

LC75281E by Onsemi is an audio control IC with 64 terminals in a square package. It operates b/w -40 to 85 °C, drawing a max of 50mA at 8V. Ideal for equalizer circuits, it features a flatpack style and gull wing terminals for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 982 parts In-Stock

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Vyrian

USA . 509 parts In-Stock

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509

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TANS Electronics

Latvia . 4,020 parts In-Stock

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4,020

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Problanco Electronics

Mexico . 3,207 parts In-Stock

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3,207

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Kulean Microsystems

USA . 3,071 parts In-Stock

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3,071

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SupplyDigital Components

Austria . 1,820 parts In-Stock

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1,820

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Corphita

USA . 1,536 parts In-Stock

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1,536

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Corohmni

South Africa . 218 parts In-Stock

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UHIMA Technologies

Türkiye . 62 parts In-Stock

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Overview

Enhance your audio experience with the LC75281E by Onsemi, a top-quality Audio Control IC that delivers unmatched performance and reliability. Designed by industry-leading experts, this product is perfect for a wide range of applications in the audio control category. With its innovative features and cutting-edge technology, the LC75281E offers customers exceptional value, benefits, and advantages. Elevate your audio system to the next level with the LC75281E from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for manufacturing the IC, ensuring reliability and affordability.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and making the installation process efficient.

Package Shape: SQUARE

Square shape facilitates efficient placement on the circuit board and allows for a streamlined design.

General IC Type: EQUALIZER CIRCUIT

Specifically designed for equalizing audio signals, ensuring high-quality sound output.

Power Supplies (V): 8

Optimal power supply voltage for the IC to operate effectively and efficiently.

No. of Terminals: 64

Sufficient number of terminals for connecting the IC to other components in the circuit.

Package Style (Meter): FLATPACK

Flatpack design saves space and allows for a compact overall product size.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the IC can withstand heat without performance degradation.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for reliable performance in various environments.

Terminal Position: QUAD

Quad terminal arrangement makes it easy to connect the IC to other components in the circuit.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminals make it easy to solder and connect the IC to the circuit board securely.

Maximum Supply Current: 50 mA

Low maximum supply current helps in reducing power consumption and heat generation.

Terminal Pitch: 0.8 mm

Small terminal pitch allows for compact packaging and efficient use of space on the circuit board.

Technical Specifications

Audio Control ICs LC75281E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

50 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC75281E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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