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LM48824TMX/NOPB

Texas Instruments

LM48824TMX/NOPB by Texas Instruments

Texas Instruments' LM48824TMX/NOPB is a Volume Control Circuit IC with 110 dB Channel Separation and 5.5% Harmonic Distortion. Ideal for audio applications, this IC operates b/w -40 to 85°C, with a power supply range of 2.4-3.6V and max supply current of 1.3 mA.

Median Price

$1.091

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,250 parts In-Stock

1+ parts

$1.124

100+ parts

$0.865

1k+ parts

$0.455

10k+ parts

-

20,250

$1.124

$0.865

$0.455

-

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.847

10k+ parts

$0.755

3,000

-

$1.020

$0.847

$0.755

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.270

10k+ parts

-

3,000

-

-

$1.270

-

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.058

10k+ parts

$0.944

3,000

-

-

$1.058

$0.944

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,290 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2,290

$0.600

-

-

-

Vyrian

USA . 1,107 parts In-Stock

1+ parts

$0.632

100+ parts

-

1k+ parts

-

10k+ parts

-

1,107

$0.632

-

-

-

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Anansix

USA . 817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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817

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 733 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$0.569

-

-

-

Component Stockers USA

USA . 16,459 parts In-Stock

1+ parts

$0.710

100+ parts

$0.670

1k+ parts

$0.490

10k+ parts

$0.490

16,459

$0.710

$0.670

$0.490

$0.490

Vigor

Singapore . 6,000 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

$0.710

-

-

-

Parana Technologies

USA . 1,448 parts In-Stock

1+ parts

$3.326

100+ parts

-

1k+ parts

$3.850

10k+ parts

-

1,448

$3.326

-

$3.850

-

ChromeModa Solutions

Germany . 6,105 parts In-Stock

1+ parts

$3.737

100+ parts

$3.064

1k+ parts

-

10k+ parts

-

6,105

$3.737

$3.064

-

-

IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$3.737

100+ parts

-

1k+ parts

$3.363

10k+ parts

-

1,519

$3.737

-

$3.363

-

DigiPath Technology Company

USA . 1,184 parts In-Stock

1+ parts

-

100+ parts

$3.369

1k+ parts

-

10k+ parts

-

1,184

-

$3.369

-

-

Overview

Enhance your audio experience with the LM48824TMX/NOPB by Texas Instruments, a top-quality Audio Control IC that promises exceptional channel separation and minimal harmonic distortion. Designed for peak performance, this product offers industrial-grade reliability and precision in a compact square package. Perfect for various applications requiring volume control circuits, this device boasts a low supply voltage while delivering crystal-clear sound at nominal output power levels. Elevate your audio projects with the unmatched value and benefits of the LM48824TMX/NOPB, setting new standards for quality and performance in the industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology offers higher component density and improved reliability, making this product suitable for compact designs and robust applications.

Channel Separation: 110 dB

High channel separation ensures clear and distinct audio signals for each channel, resulting in a superior audio performance.

Harmonic Distortion: 5.5 %

Low harmonic distortion helps in maintaining the integrity of the audio signal, resulting in high fidelity sound output.

Power Supplies (V): 3.6

Supports a wide range of power supply voltages, allowing flexibility in design and compatibility with various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated environmental temperatures, ensuring reliable performance in harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in cold environments or applications with varying temperature ranges.

Nominal Output Power: 0.037 W

Despite its low nominal output power, this product is efficient and can deliver sufficient power for various audio control applications.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, making this product versatile and easy to integrate.

Technical Specifications

Audio Control ICs LM48824TMX/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

110 dB

General IC Type:

Harmonic Distortion:

5.5 %

JESD-30 Code:

S-XBGA-B16

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.037 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA16,4X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

1.3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM48824TMX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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