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LC75348M

Onsemi

LC75348M by Onsemi

The Onsemi LC75348M is a CMOS Audio Control IC with 30 terminals in a small outline package. It operates b/w -30 °C to 70°C, powered by 9V supplies. Ideal for audio applications requiring precise control and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,974 parts In-Stock

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1,974

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Digiode

USA . 1,201 parts In-Stock

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1,201

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,740 parts In-Stock

1+ parts

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6,740

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TANS Electronics

Latvia . 4,791 parts In-Stock

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4,791

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Kulean Microsystems

USA . 4,515 parts In-Stock

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4,515

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Corphita

USA . 1,348 parts In-Stock

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1,348

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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152

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Corohmni

South Africa . 147 parts In-Stock

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147

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SupplyDigital Components

Austria . 140 parts In-Stock

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140

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Overview

Experience unparalleled audio control with the LC75348M by Onsemi. Crafted with precision and expertise, this Audio Control IC offers exceptional quality and reliability. Ideal for a wide range of applications, this product provides unmatched value and benefits to customers. Elevate your audio experience with the LC75348M and discover the advantages that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the IC, making it resistant to external damage.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the IC onto a PCB, saving time and space in the manufacturing process.

Power Supplies (V): 9

With a power supply of 9V, this IC is suitable for a wide range of audio applications, providing sufficient voltage for optimal performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures that the IC remains stable and reliable even under challenging environmental conditions.

Technology: CMOS

The CMOS technology used in this IC allows for low power consumption and high noise immunity, resulting in efficient and reliable audio control.

Terminal Form: GULL WING

The gull wing terminal form is ideal for surface mounting, providing a secure connection to the PCB and facilitating easy assembly.

Technical Specifications

Audio Control ICs LC75348M attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LC75348M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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