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STA369BWS

STMicroelectronics

STA369BWS by STMicroelectronics

STA369BWS by STMicroelectronics is a versatile audio control IC designed for volume management in compact devices. It operates at 3.3V and 18V, features a small outline package with 36 terminals, and withstands temperatures from -20 °C to 70°C. Ideal for consumer electronics, it ensures reliable performance in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,065 parts In-Stock

1+ parts

-

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1k+ parts

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2,065

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-

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Digiode

USA . 1,115 parts In-Stock

1+ parts

-

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-

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1,115

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-

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Anansix

USA . 776 parts In-Stock

1+ parts

-

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776

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 80 parts In-Stock

1+ parts

$0.576

100+ parts

-

1k+ parts

$0.518

10k+ parts

-

80

$0.576

-

$0.518

-

MKK Technologies

India . 770 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$1.083

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-

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DigiPath Technology Company

USA . 770 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

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770

$1.083

-

-

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Microchip USA

USA . 131 parts In-Stock

1+ parts

$3.494

100+ parts

-

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131

$3.494

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AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$17.380

100+ parts

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466

$17.380

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-

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A-Z Elektronik GmbH

Germany . 4,913 parts In-Stock

1+ parts

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4,913

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Vigor

Singapore . 4,143 parts In-Stock

1+ parts

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4,143

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 1,877 parts In-Stock

1+ parts

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1,877

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Parana Technologies

USA . 1,692 parts In-Stock

1+ parts

-

100+ parts

$0.689

1k+ parts

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1,692

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$0.689

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RC Electronics

USA . 143 parts In-Stock

1+ parts

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143

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Overview

Elevate your audio experience with the STA369BWS from STMicroelectronics, a leader in innovation and quality. This advanced audio control IC offers seamless volume management, ensuring crisp sound without compromise. Its robust design fits perfectly into a variety of applications—from consumer electronics to professional audio systems—bringing unparalleled clarity and performance. Trust in STMicroelectronics for reliable solutions that enhance your products and delight your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making this IC reliable in various applications.

Surface Mount: YES

Being a surface mount component allows for easier assembly and integration into compact circuit designs, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space efficiency on PCBs, making it suitable for modern electronic designs.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, this IC is an excellent choice for audio systems requiring precise and noise-free volume adjustments.

Power Supplies: 3.3V, 18V

With the capability to operate at two different supply voltages, this IC offers flexibility for various audio device power requirements.

No. of Terminals: 36

A higher number of terminals provides comprehensive connectivity options, facilitating versatile integration into complex electronic systems.

Package Style: SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing designers to optimize board layout without sacrificing performance.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can function effectively in warmer environments, ensuring reliability in diverse operating conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures that this IC remains functional in cooler settings, broadening its usability across various climates.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin finish provides excellent solderability and reliability, ensuring strong and durable connections within the circuit.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility, making it easier to arrange components in tight spaces without compromising on performance.

Maximum Time At Peak Reflow Temperature: 30s

A maximum time of 30 seconds at peak reflow temperature ensures that the IC can withstand the assembly process without degradation, maintaining its longevity.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature indicates that this IC is designed to endure high-temperature soldering processes common in modern PCB manufacturing.

Temperature Grade: COMMERCIAL

This commercial temperature grade makes the IC suitable for a wide range of consumer electronics, ensuring broad applicability in everyday products.

Terminal Form: GULL WING

Gull wing terminal form is popular for surface mount applications as it simplifies PCB assembly and provides reliable mechanical strength.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense packing of components on the PCB, maximizing the functionality of limited board space.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC can withstand a reasonable level of moisture exposure during assembly, ensuring reliability even in humid environments.

Technical Specifications

Audio Control ICs STA369BWS attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,18

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STA369BWS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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