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TDA7469A

STMicroelectronics

TDA7469A by STMicroelectronics

TDA7469A by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 50 dB channel separation, 0.1% harmonic distortion, and operates b/w 1.8V to 5V. Ideal for enhancing sound quality in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,745 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,745

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Digiode

USA . 3,659 parts In-Stock

1+ parts

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1k+ parts

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3,659

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Anansix

USA . 2,795 parts In-Stock

1+ parts

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2,795

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 436 parts In-Stock

1+ parts

$2.429

100+ parts

-

1k+ parts

$2.186

10k+ parts

-

436

$2.429

-

$2.186

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MKK Technologies

India . 1,122 parts In-Stock

1+ parts

$4.567

100+ parts

-

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1,122

$4.567

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DigiPath Technology Company

USA . 1,122 parts In-Stock

1+ parts

$4.567

100+ parts

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1,122

$4.567

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Corphita

USA . 2,453 parts In-Stock

1+ parts

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2,453

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Parana Technologies

USA . 16 parts In-Stock

1+ parts

-

100+ parts

$2.904

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10k+ parts

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16

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$2.904

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Overview

Elevate your audio experience with the TDA7469A from STMicroelectronics, a leader in innovative tech solutions. This advanced tone control IC offers exceptional sound quality and reliability, ensuring your devices deliver the best auditory performance. With its compact design and robust construction, it seamlessly integrates into various applications, enhancing everything from home audio systems to automotive entertainment. Trust STMicroelectronics for proven excellence in audio technology—where clarity meets convenience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and robustness in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly in modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency for PCB layout, making it suitable for space-constrained designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it enhances audio quality, providing flexibility for audio applications.

Channel Separation: 50 dB

High channel separation minimizes crosstalk, resulting in clearer and more distinct audio channels.

Harmonic Distortion: 0.1 %

Low harmonic distortion ensures high fidelity audio playback, making it ideal for high-quality audio systems.

Power Supplies (V): 2.4

The standard power supply voltage of 2.4V is compatible with many electronic systems, enhancing versatility.

No. of Terminals: 20

A sufficient number of terminals allows for multiple connections, accommodating various functionalities in audio systems.

Package Style (Meter): SMALL OUTLINE

The small outline package type contributes to a compact footprint, suitable for modern electronic devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures that the IC can function effectively in demanding environments.

No. of Bands: 2

With two bands, this IC allows for versatile audio adjustments, catering to various audio preferences.

Minimum Operating Temperature: -10 °C

The ability to operate at temperatures as low as -10 °C makes this IC suitable for various climates and applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish offers excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning allows for easier mounting options, facilitating design flexibility.

Maximum Seated Height: 2.65 mm

A low seated height allows for slim designs, which is particularly advantageous in portable audio devices.

Width: 7.5 mm

A compact width helps in conserving PCB space, allowing for more efficient layout designs.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage increases energy efficiency, making it suitable for battery-operated devices.

Length: 12.8 mm

A short length contributes to a compact form factor, making it ideal for tight spaces in electronic assemblies.

No. of Channels: 2

With two channels, this IC can effectively support stereo sound systems, enhancing user experience.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS transistors, offering excellent performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and are popular for surface mount applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm facilitates compatible designs with a wide range of PCBs.

Maximum Supply Voltage (Vsup): 5 V

A maximum supply voltage of 5V allows for compatibility with a wide range of operating systems and devices.

Technical Specifications

Audio Control ICs TDA7469A attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

50 dB

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7469A General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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