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LM4842MH

Texas Instruments

LM4842MH by Texas Instruments

LM4842MH by Texas Instruments is a 2-channel audio control IC with tone control circuit. It offers 65 dB channel separation and operates on power supplies from 2.7V to 5.5V, making it ideal for industrial applications requiring precise audio adjustments in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,717 parts In-Stock

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Anansix

USA . 2,437 parts In-Stock

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2,437

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Digiode

USA . 1,521 parts In-Stock

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1,521

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 992 parts In-Stock

1+ parts

$2.836

100+ parts

-

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$3.324

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992

$2.836

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$3.324

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ChromeModa Solutions

Germany . 6,492 parts In-Stock

1+ parts

$3.187

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$2.613

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6,492

$3.187

$2.613

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IDEA Electronic Components Group

UK . 1,414 parts In-Stock

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$3.187

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$2.868

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1,414

$3.187

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$2.868

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AZTECH Wire

Italy . 607 parts In-Stock

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$12.359

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607

$12.359

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One Stop Electronics

USA . 317 parts In-Stock

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$12.800

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317

$12.800

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Alle Elektronik GmbH

Germany . 3,764 parts In-Stock

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Corphita

USA . 3,071 parts In-Stock

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3,071

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DigiPath Technology Company

USA . 1,210 parts In-Stock

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$2.873

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1,210

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$2.873

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Overview

Experience superior audio control with the LM4842MH by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. This audio control IC offers exceptional channel separation and operates at a wide temperature range, making it ideal for industrial applications. With a compact design and easy surface mount installation, this tone control circuit provides high-quality sound in a slim profile package. Upgrade your audio systems with the LM4842MH and enjoy unparalleled performance and reliability that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for audio control ICs that may be frequently handled or moved.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and simplifying manufacturing processes.

General IC Type: TONE CONTROL CIRCUIT

Specifically designed for tone control circuits, ensuring optimized performance and functionality for audio manipulation and enhancement.

Channel Separation: 65 dB

High channel separation ensures minimal interference between audio channels, resulting in clear and accurate sound reproduction.

Power Supplies (V): 5

Operating at 5 volts provides sufficient power for the IC to function reliably and efficiently in various audio control applications.

No. of Terminals: 28

Having 28 terminals offers flexibility in connectivity options and enables the IC to interface with different components in complex audio systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand elevated temperatures without compromising its performance, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function in cold environments without issues, increasing its versatility and reliability.

Terminal Finish: Tin/Lead (Sn85Pb15)

The tin/lead terminal finish provides good solderability and ensures secure connections, enhancing the overall reliability and longevity of the IC.

Width: 4.4 mm

With a slim width of 4.4 mm, the IC can be easily accommodated in compact spaces, making it suitable for applications with limited real estate.

No. of Channels: 2

Featuring 2 channels allows for stereo audio control, enabling the IC to process and adjust the sound output for a more immersive listening experience.

Technical Specifications

Audio Control ICs LM4842MH attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

LM4842MH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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