Loading...

TDA7448

STMicroelectronics

TDA7448 by STMicroelectronics

TDA7448 by STMicroelectronics is a versatile audio control IC designed for volume management in consumer electronics. It features 90 dB channel separation, 0.01% harmonic distortion, and operates b/w 4.75V to 10V. Ideal for compact applications, it comes in a small outline package with dual terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,100

-

-

-

-

Vyrian

USA . 3,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,506

-

-

-

-

Digiode

USA . 1,667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,667

-

-

-

-

Anansix

USA . 1,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,137

-

-

-

-

Cyclops Electronics Ltd

UK . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

LittleDiode

UK . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$1.547

100+ parts

-

1k+ parts

$1.393

10k+ parts

-

2,116

$1.547

-

$1.393

-

MKK Technologies

India . 1,771 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,771

$2.910

-

-

-

DigiPath Technology Company

USA . 1,771 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,771

$2.910

-

-

-

Microchip USA

USA . 482 parts In-Stock

1+ parts

$3.024

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$3.024

-

-

-

AZTECH Wire

Italy . 1,178 parts In-Stock

1+ parts

$15.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,178

$15.250

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,190

-

-

-

-

Corphita

USA . 4,308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,308

-

-

-

-

Parana Technologies

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

$1.850

1k+ parts

-

10k+ parts

-

2,377

-

$1.850

-

-

RC Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Metaverse IC Inc.

Canada . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Kepictronics

USA . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98

-

-

-

-

Assy Fe

Spain . 77 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77

-

-

-

-

Overview

Elevate your audio experience with the TDA7448 from STMicroelectronics, a leader in innovative audio control solutions. This compact IC offers exceptional sound quality and reliability, featuring outstanding channel separation and minimal distortion for crystal-clear playback. Perfect for home theater systems, automotive audio, and portable devices, the TDA7448 ensures effortless volume control while enhancing your listening pleasure—experience music like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic epoxy as the package body material ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount configuration allows for compact design and ease of integration into modern electronics, facilitating efficient use of PCB space.

Package Shape: RECTANGULAR

The rectangular shape of the package aids in systematic placement on PCBs, optimizing layout and improving performance.

General IC Type: VOLUME CONTROL CIRCUIT

Being a dedicated volume control circuit IC enhances its functionality in audio applications, providing precise control for high-quality sound output.

Channel Separation: 90 dB

With a channel separation of 90 dB, this IC minimizes cross-talk between channels, resulting in clear and distinct sound output.

Harmonic Distortion: 0.01 %

A low harmonic distortion of 0.01% ensures high fidelity in audio reproduction, making it suitable for high-quality audio devices.

Power Supplies (V): 9

Operating at 9V makes this IC compatible with a wide range of audio equipment, providing flexibility in various applications.

No. of Terminals: 20

With 20 terminals, it offers multiple connection options, enhancing versatility in design and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suitable for compact designs, allowing integration into space-constrained environments.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance under typical environmental conditions, enhancing product longevity.

Minimum Operating Temperature: 0 °C

This IC can function effectively from 0 °C, making it suitable for a variety of temperature-sensitive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel palladium gold terminal finish enhances corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for better accessibility and aligns with typical PCB layout practices for ease of use in designs.

Maximum Seated Height: 2.65 mm

A low seated height ensures a compact profile, allowing for layered designs in devices where space is at a premium.

Width: 7.5 mm

The 7.5 mm width contributes to compact PCB designs while maintaining necessary functionalities without sacrificing performance.

Minimum Supply Voltage (Vsup): 4.75 V

A minimum supply voltage of 4.75V allows the IC to operate in diverse electrical environments, providing flexibility for a range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, facilitating easier manufacturing and assembly.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C ensures robust soldering capability, promoting excellent durability and reliability of the IC.

Length: 12.8 mm

The compact length of 12.8 mm allows for streamlined PCB layouts and efficient use of space in electronic assemblies.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, ensuring reliable performance in standard operating conditions typical for consumer electronics.

No. of Channels: 6

With 6 channels, it caters to multi-channel audio devices, enabling versatile usage in high-performance audio setups.

Technology: BICMOS

Using BICMOS technology allows for low power consumption while providing excellent performance, making it ideal for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and assembly during production, ensuring reliable solder joints and improved product durability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances compact design with ease of manufacturing, making the IC suitable for a variety of PCB layouts.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, allowing for reasonable storage and handling requirements prior to assembly.

Maximum Supply Voltage (Vsup): 10 V

A maximum supply voltage of 10V provides a wide operational range, accommodating various audio applications and ensuring reliable performance.

Technical Specifications

Audio Control ICs TDA7448 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7448 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20