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LM4949TLX/NOPB

Texas Instruments

LM4949TLX/NOPB by Texas Instruments

Texas Instruments' LM4949TLX/NOPB is a 2-function audio control IC with 25 terminals in a square package. It operates at -40 to 85°C, suitable for industrial use. With volume control circuit and low supply current of 10.9mA, it's ideal for audio applications requiring precise volume adjustments.

Median Price

$1.044

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 99 parts In-Stock

1+ parts

$1.797

100+ parts

$1.635

1k+ parts

$1.474

10k+ parts

-

99

$1.797

$1.635

$1.474

-

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.914

1k+ parts

$0.758

10k+ parts

$0.676

6,000

-

$0.914

$0.758

$0.676

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.140

10k+ parts

-

6,000

-

-

$1.140

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.948

10k+ parts

$0.845

6,000

-

-

$0.948

$0.845

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,776 parts In-Stock

1+ parts

$0.711

100+ parts

-

1k+ parts

-

10k+ parts

-

1,776

$0.711

-

-

-

Vyrian

USA . 3,908 parts In-Stock

1+ parts

$0.748

100+ parts

-

1k+ parts

-

10k+ parts

-

3,908

$0.748

-

-

-

Anansix

USA . 2,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,672

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,203 parts In-Stock

1+ parts

$0.673

100+ parts

-

1k+ parts

-

10k+ parts

-

4,203

$0.673

-

-

-

Advanced Electronics

New Zealand . 99 parts In-Stock

1+ parts

$1.797

100+ parts

$1.635

1k+ parts

$1.474

10k+ parts

-

99

$1.797

$1.635

$1.474

-

Parana Technologies

USA . 861 parts In-Stock

1+ parts

$2.704

100+ parts

-

1k+ parts

$3.186

10k+ parts

-

861

$2.704

-

$3.186

-

DigiPath Technology Company

USA . 1,789 parts In-Stock

1+ parts

$2.977

100+ parts

-

1k+ parts

-

10k+ parts

-

1,789

$2.977

-

-

-

ChromeModa Solutions

Germany . 4,371 parts In-Stock

1+ parts

$3.038

100+ parts

$2.491

1k+ parts

-

10k+ parts

-

4,371

$3.038

$2.491

-

-

IDEA Electronic Components Group

UK . 208 parts In-Stock

1+ parts

$3.038

100+ parts

-

1k+ parts

$2.734

10k+ parts

-

208

$3.038

-

$2.734

-

GreenTree Electronics

Israel . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Microchip USA

USA . 1,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

-

-

-

-

Overview

Unlock the power of sound with the LM4949TLX/NOPB from Texas Instruments. This audio control IC offers top-notch quality and reliability, backed by the trusted name of its manufacturer. Perfect for applications in volume control circuits, this product provides customers with unparalleled value and benefits. Whether you're looking to enhance your audio experience or streamline your design, the LM4949TLX/NOPB is the perfect solution for all your audio control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product durable and resistant to environmental factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the product onto circuit boards.

No. of Functions: 2

Having 2 functions in one component can save space on the circuit board and reduce the overall component count.

Package Shape: SQUARE

A square package shape is convenient for space-saving and efficient layout on the PCB.

General IC Type: VOLUME CONTROL CIRCUIT

The volume control circuit type ensures accurate and precise control of audio levels.

Power Supplies (V): 3/5

Support for power supplies of 3V and 5V makes the product versatile and suitable for a wide range of applications.

No. of Terminals: 25

Having 25 terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch packaging style offers high density integration and precise alignment during assembly.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold conditions as well.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and allows for easy soldering during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without damaging the component.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees secure and reliable solder joints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions in industrial environments.

Terminal Form: BALL

The ball terminal form provides stable electrical connections and facilitates automated component placement.

Maximum Supply Current: 10.9 mA

The maximum supply current of 10.9 mA ensures efficient power consumption and reliable operation within specified limits.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density mounting and precise alignment during PCB assembly.

Technical Specifications

Audio Control ICs LM4949TLX/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

10.9 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM4949TLX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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