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LC75410W

Onsemi

LC75410W by Onsemi

LC75410W by Onsemi is an Audio Control IC with 64 terminals in a square flatpack package. Operating temperature ranges from -40 °C to 85°C, suitable for industrial use. It operates at 9V power supply and consumes a max of 45mA, making it ideal for audio applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,756 parts In-Stock

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Vyrian

USA . 656 parts In-Stock

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656

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TANS Electronics

Latvia . 7,605 parts In-Stock

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7,605

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Kulean Microsystems

USA . 7,529 parts In-Stock

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7,529

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SupplyDigital Components

Austria . 6,119 parts In-Stock

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6,119

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Problanco Electronics

Mexico . 4,887 parts In-Stock

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4,887

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Corphita

USA . 1,945 parts In-Stock

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1,945

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UHIMA Technologies

Türkiye . 550 parts In-Stock

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550

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Corohmni

South Africa . 246 parts In-Stock

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Overview

Elevate your audio control experience with the LC75410W by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Ideal for a wide range of applications in the audio industry, this Audio Control IC will enhance your sound system performance effortlessly. Unlock the full potential of your audio devices with this cutting-edge technology, delivering exceptional value and benefits to customers seeking top-notch audio control solutions. Trust in Onsemi's reputation for excellence and elevate your audio experience today with the LC75410W.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board, enabling compact design and layout.

Power Supplies (V): 9

Operating at 9V power supply provides sufficient power for the audio control IC to function optimally.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and flexibility in configuring the IC for various audio control functions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can withstand high temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C ensures the IC's functionality in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position provides stability and reliability in connections, minimizing the risk of signal loss or interruptions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable performance.

Maximum Supply Current: 45 mA

With a maximum supply current of 45 mA, the IC operates efficiently without drawing excessive power from the power supply.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for precise and secure connections, ensuring stable performance of the IC in audio control applications.

Technical Specifications

Audio Control ICs LC75410W attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

45 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75410W General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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