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LM4836MT

Texas Instruments

LM4836MT by Texas Instruments

LM4836MT by Texas Instruments is a 2-channel audio control IC with 65 dB channel separation and 1% harmonic distortion. It comes in a small outline package suitable for industrial applications, operating b/w -40 to 85°C. Ideal for tone control circuits requiring low supply voltage of 2.7V to 5.5V and max current of 30mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,248 parts In-Stock

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Digiode

USA . 4,098 parts In-Stock

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Anansix

USA . 968 parts In-Stock

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968

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Florida Circuit

USA . 261 parts In-Stock

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Component Electronics Inc.

Canada . 4 parts In-Stock

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Parana Technologies

USA . 437 parts In-Stock

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$1.655

100+ parts

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$2.265

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437

$1.655

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$2.265

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DigiPath Technology Company

USA . 1,422 parts In-Stock

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$1.822

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$1.822

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ChromeModa Solutions

Germany . 3,049 parts In-Stock

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$1.859

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$1.524

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3,049

$1.859

$1.524

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IDEA Electronic Components Group

UK . 409 parts In-Stock

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$1.859

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$1.673

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409

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One Stop Electronics

USA . 295 parts In-Stock

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$9.800

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295

$9.800

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AZTECH Wire

Italy . 192 parts In-Stock

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$12.527

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,354 parts In-Stock

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Corphita

USA . 1,247 parts In-Stock

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Assy Fe

Spain . 34 parts In-Stock

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Overview

Enhance the audio experience with the LM4836MT by Texas Instruments. This top-notch audio control IC boasts exceptional channel separation and low harmonic distortion, ensuring crystal-clear sound quality. Whether you're designing a portable speaker or a home entertainment system, this versatile component offers unmatched performance. With Texas Instruments' reputation for reliability and innovation, you can trust that the LM4836MT will exceed your expectations. Upgrade your audio projects today with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the circuit board.

Channel Separation: 65 dB

High channel separation ensures clear and distinct audio signals for each channel.

Harmonic Distortion: 1 %

Low harmonic distortion leads to cleaner and more accurate audio output.

No. of Terminals: 28

The high number of terminals allow for versatile connectivity options and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand extended periods of use without overheating.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the product to function in extreme conditions.

Terminal Finish: Tin/Lead (Sn85Pb15)

The tin/lead terminal finish provides good solderability and reliability.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Audio Control ICs LM4836MT attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

LM4836MT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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