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TDA7345D

STMicroelectronics

TDA7345D by STMicroelectronics

STMicroelectronics TDA7345D is a BICMOS audio control IC with 2 channels, offering 70 dB channel separation and 0.02% harmonic distortion. It features tone control circuitry, operates on 7-10.5 V supplies, and is ideal for applications requiring precise audio adjustments in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,462 parts In-Stock

1+ parts

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4,462

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Vyrian

USA . 3,294 parts In-Stock

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3,294

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Anansix

USA . 2,123 parts In-Stock

1+ parts

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2,123

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,392 parts In-Stock

1+ parts

$0.253

100+ parts

-

1k+ parts

$0.228

10k+ parts

-

1,392

$0.253

-

$0.228

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MKK Technologies

India . 1,769 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

-

10k+ parts

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1,769

$0.476

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DigiPath Technology Company

USA . 1,769 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

-

10k+ parts

-

1,769

$0.476

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-

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A-Z Elektronik GmbH

Germany . 7,185 parts In-Stock

1+ parts

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7,185

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Corphita

USA . 2,828 parts In-Stock

1+ parts

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2,828

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Parana Technologies

USA . 2,284 parts In-Stock

1+ parts

-

100+ parts

$0.302

1k+ parts

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10k+ parts

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2,284

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$0.302

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Kepictronics

USA . 79 parts In-Stock

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79

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Overview

Elevate your audio experience with the TDA7345D by STMicroelectronics, a cutting-edge Audio Control IC that delivers superior quality and precision in tone control. Manufactured by industry leader STMicroelectronics, this device offers unparalleled channel separation of 70dB and minimal harmonic distortion of just 0.02%. Ideal for a wide range of applications, including automotive and home audio systems, the TDA7345D provides customers with exceptional value, enhanced sound performance, and effortless integration thanks to its compact design and advanced BICMOS technology. Upgrade your audio setup today with the TDA7345D and enjoy top-notch audio control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

General IC Type: TONE CONTROL CIRCUIT

The tone control circuit type indicates that the product can effectively adjust frequencies and enhance audio quality.

Channel Separation: 70 dB

High channel separation of 70 dB ensures clear and distinct audio output from each channel.

Harmonic Distortion: 0.02 %

Low harmonic distortion of 0.02% results in clean and accurate sound reproduction.

Power Supplies (V): 9

Operates on a standard power supply of 9V, making it compatible with most audio systems.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for various audio input and output sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in challenging environments.

No. of Bands: 2

Supports 2 bands for tone control adjustment, offering versatility in audio customization.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed performance.

Technical Specifications

Audio Control ICs TDA7345D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

70 dB

General IC Type:

Harmonic Distortion:

.02 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7345D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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