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TDA7313D013TR

STMicroelectronics

TDA7313D013TR by STMicroelectronics

TDA7313D013TR by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 103 dB channel separation, 0.09% harmonic distortion, and operates within -40 °C to 85°C. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,042 parts In-Stock

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3,042

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Anansix

USA . 1,973 parts In-Stock

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1,973

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Digiode

USA . 872 parts In-Stock

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872

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 902 parts In-Stock

1+ parts

$2.591

100+ parts

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$2.332

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902

$2.591

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$2.332

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MKK Technologies

India . 1,058 parts In-Stock

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$4.872

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1,058

$4.872

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DigiPath Technology Company

USA . 1,058 parts In-Stock

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$4.872

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1,058

$4.872

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Corphita

USA . 3,486 parts In-Stock

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3,486

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Kepictronics

USA . 1,707 parts In-Stock

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1,707

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Parana Technologies

USA . 813 parts In-Stock

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$3.098

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813

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$3.098

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Overview

Elevate your audio experience with the TDA7313D013TR from STMicroelectronics, a leader in innovative technology. This high-performance audio control IC boasts exceptional sound quality, featuring remarkable channel separation and minimal distortion, perfect for diverse applications from home theater systems to automotive audio. Trust in STMicroelectronics’ commitment to excellence and reliability, ensuring you get superior performance and value in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and stability, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration into modern circuit designs, saving space and improving performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout, maximizing space and improving component density.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC allows for precise audio manipulation, enhancing audio quality in applications.

Channel Separation: 103 dB

High channel separation improves audio clarity by minimizing crosstalk, leading to a superior listening experience.

Harmonic Distortion: 0.09 %

Low harmonic distortion ensures a clean output signal, preserving audio fidelity for high-quality sound applications.

No. of Terminals: 28

A higher number of terminals provides more connections for versatile functionality and ease of integration.

Package Style (Meter): SMALL OUTLINE

Small outline package style is designed for compact applications, making it ideal for portable or space-constrained devices.

Maximum Operating Temperature: 85 °C

With a higher operating temperature range, this IC can perform reliably in harsh conditions, increasing its usability.

No. of Bands: 2

Dual band control allows for more flexible sound tuning, catering to different audio preferences.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures expands the range of applications, making it suitable for outdoor or extreme environments.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of PCB layout and ensures proper electrical connections.

Maximum Seated Height: 2.65 mm

The low seated height allows for better compatibility with compact designs, facilitating integration into thin devices.

Width: 7.5 mm

The compact width contributes to space-saving designs that allow for higher circuit density.

Minimum Supply Voltage (Vsup): 6 V

A minimum supply voltage of 6 V allows for compatibility with a variety of power supply configurations, enhancing versatility.

Length: 17.9 mm

A moderate length supports diverse mounting and integration options, while maintaining efficient space usage.

Temperature Grade: INDUSTRIAL

Industrial temperature grading signifies robustness and reliability in demanding applications and environments.

No. of Channels: 2

With two channels, this IC enables stereo sound applications, making it suitable for a wide range of audio devices.

Technology: BICMOS

BICMOS technology offers the advantages of both bipolar and CMOS designs, leading to enhanced performance and lower power consumption.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering capability and mechanical stability in PCB assembly.

Maximum Supply Current: 11 mA

Low maximum supply current helps in energy-efficient designs, which is crucial for battery-operated devices.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm facilitates easy soldering and integration into existing PCB designs.

Maximum Supply Voltage (Vsup): 10 V

A maximum supply voltage of 10 V adds flexibility in power supply choices, accommodating different application needs.

Technical Specifications

Audio Control ICs TDA7313D013TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.09 %

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7313D013TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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