Loading...

TDA7449L

STMicroelectronics

TDA7449L by STMicroelectronics

TDA7449L by STMicroelectronics is a BICMOS audio control IC designed for volume control in audio applications. It features 100 dB channel separation, 0.01% harmonic distortion, and operates b/w 6-10.2 V. Ideal for high-fidelity sound systems, it ensures superior audio performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,256

-

-

-

-

Digiode

USA . 2,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,441

-

-

-

-

Anansix

USA . 1,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,550

-

-

-

-

LWI Electronics Inc

India . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 271 parts In-Stock

1+ parts

$0.896

100+ parts

-

1k+ parts

-

10k+ parts

-

271

$0.896

-

-

-

IDEA Electronic Components Group

UK . 1,274 parts In-Stock

1+ parts

$1.561

100+ parts

-

1k+ parts

$1.405

10k+ parts

-

1,274

$1.561

-

$1.405

-

MKK Technologies

India . 2,275 parts In-Stock

1+ parts

$2.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$2.936

-

-

-

DigiPath Technology Company

USA . 2,275 parts In-Stock

1+ parts

$2.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$2.936

-

-

-

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$11.120

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$11.120

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,101

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,828

-

-

-

-

Corphita

USA . 3,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,172

-

-

-

-

Parana Technologies

USA . 2,025 parts In-Stock

1+ parts

-

100+ parts

$1.867

1k+ parts

-

10k+ parts

-

2,025

-

$1.867

-

-

Kepictronics

USA . 1,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,006

-

-

-

-

Perfect Parts

USA . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67

-

-

-

-

Overview

Elevate your audio experience with the TDA7449L from STMicroelectronics, a leader in innovative technology. This premium audio control IC ensures crystal-clear sound quality and seamless volume management, perfect for high-fidelity applications in home theaters, automotive systems, and professional audio equipment. With its robust performance and exceptional reliability, the TDA7449L delivers unmatched value, enhancing your listening pleasure while simplifying design integration. Choose STMicroelectronics for superior quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection against environmental factors, making this IC suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and simplifies the assembly process.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control, this IC offers precise adjustments, enhancing user experience in audio applications.

Channel Separation: 100 dB

A high channel separation of 100 dB minimizes crosstalk, ensuring superior sound quality and clarity between channels.

Harmonic Distortion: 0.01 %

With very low harmonic distortion, this IC guarantees a clean and faithful reproduction of audio signals.

Power Supplies (V): 9

Operating at a standard power supply voltage of 9V makes it compatible with various audio equipment and simplifies integration.

No. of Terminals: 20

The 20 terminal design allows for versatile connections and functionality, making it suitable for complex audio systems.

Package Style (Meter): IN-LINE

The in-line package style helps streamline the PCB layout, aiding in efficient circuit design.

Maximum Operating Temperature: 85 °C

The IC’s ability to operate at high temperatures (up to 85 °C) allows it to perform reliably in demanding environments.

Minimum Operating Temperature: -10 °C

With a minimum operating temperature of -10 °C, this product is capable of functioning in cooler climates, broadening its usability.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and ensures longevity, reducing the chances of corrosion and failure.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design, facilitating easier installation in various audio devices.

Maximum Seated Height: 3.93 mm

A low maximum seated height allows for compact designs, making it easier to fit in slim audio devices.

Width: 7.62 mm

A moderate width makes it suitable for various PCB designs while still allowing efficient routing of signals.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage of 6V ensures compatibility with lower power systems, enhancing its versatility.

Length: 25.15 mm

This length enables a balance between space utilization and component functionality, fitting well into compact designs.

No. of Channels: 2

Offering two channels, this IC is ideal for stereo applications, improving audio performance and user experience.

Technology: BICMOS

Utilizing BICMOS technology results in low power consumption and high performance, ideal for audio applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures stable connections and solder joints for reliable operation in various environments.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54mm enhances compatibility with most PCB designs and simplifies assembly.

Maximum Supply Voltage (Vsup): 10.2 V

The maximum supply voltage of 10.2V allows flexibility in power sources, making it adaptable for different applications.

Technical Specifications

Audio Control ICs TDA7449L attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7449L General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20