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LM4682SQ

Texas Instruments

LM4682SQ by Texas Instruments

LM4682SQ by Texas Instruments is a 48-terminal audio amplifier IC with 10W output power. Operating b/w -40 to 85°C, it has a nominal bandwidth of 0.022 kHz and supports two channels. Ideal for industrial applications, this square-shaped chip carrier is surface-mountable and requires a supply voltage of 8.5-15V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,823 parts In-Stock

1+ parts

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4,823

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Digiode

USA . 4,238 parts In-Stock

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4,238

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Anansix

USA . 900 parts In-Stock

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 816 parts In-Stock

1+ parts

$0.434

100+ parts

-

1k+ parts

$1.602

10k+ parts

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816

$0.434

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$1.602

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DigiPath Technology Company

USA . 2,181 parts In-Stock

1+ parts

$0.478

100+ parts

$0.440

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2,181

$0.478

$0.440

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ChromeModa Solutions

Germany . 6,784 parts In-Stock

1+ parts

$0.488

100+ parts

$0.400

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6,784

$0.488

$0.400

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IDEA Electronic Components Group

UK . 1,301 parts In-Stock

1+ parts

$0.488

100+ parts

-

1k+ parts

$0.439

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1,301

$0.488

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$0.439

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One Stop Electronics

USA . 974 parts In-Stock

1+ parts

$16.800

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974

$16.800

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AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$17.908

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439

$17.908

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Corphita

USA . 4,296 parts In-Stock

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4,296

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Perfect Parts

USA . 7 parts In-Stock

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7

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Overview

Discover the LM4682SQ by Texas Instruments, a top-quality audio amplifier that offers unparalleled performance for all your sound control needs. With Texas Instruments' reputation for excellence in manufacturing and innovation, you can trust that this product delivers on its promise of superior quality and reliability. Ideal for a wide range of audio applications, this chip carrier IC boasts a very thin profile, making it perfect for compact designs without compromising on power or efficiency. Experience the benefits of crystal-clear sound and seamless control with the LM4682SQ, setting a new standard for audio amplification in industrial-grade settings. Elevate your audio experience today with the LM4682SQ from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making this product ideal for mass production and compact designs.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easier layout and integration in electronic circuits.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, ensuring optimal performance and sound quality for audio applications.

Power Supplies (V): 12

Operates at a power supply voltage of 12V, suitable for a wide range of audio equipment and applications.

No. of Terminals: 48

Provides ample connectivity options for complex audio circuit configurations and signal routing.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer efficient heat dissipation and space-saving advantages.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, making it suitable for industrial applications where heat may be a concern.

Nominal Output Power: 10 W

Delivers a nominal output power of 10W, providing sufficient audio amplification for various audio devices and systems.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, ensuring reliability and performance in harsh operating environments.

No. of Channels: 2

Dual-channel configuration allows for stereo audio output, enhancing the listening experience for users.

Technical Specifications

Audio Control ICs LM4682SQ attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

10 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

LM4682SQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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