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LM4844TL

Texas Instruments

LM4844TL by Texas Instruments

LM4844TL by Texas Instruments is a Volume Control Circuit IC with 84 dB Channel Separation. It features a 30-terminal Grid Array package style, suitable for industrial applications. Operating b/w -40 to 85°C, it supports 2 channels and requires a supply voltage of 2.7-5.5V for audio control in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,515 parts In-Stock

1+ parts

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4,515

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Vyrian

USA . 3,303 parts In-Stock

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3,303

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Anansix

USA . 119 parts In-Stock

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119

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,036 parts In-Stock

1+ parts

$1.852

100+ parts

$171.995

1k+ parts

$1.667

10k+ parts

-

1,036

$1.852

$171.995

$1.667

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DigiPath Technology Company

USA . 2,181 parts In-Stock

1+ parts

$2.039

100+ parts

$1.876

1k+ parts

-

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2,181

$2.039

$1.876

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IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$2.081

100+ parts

-

1k+ parts

$1.873

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1,492

$2.081

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$1.873

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ChromeModa Solutions

Germany . 1,300 parts In-Stock

1+ parts

$2.081

100+ parts

$1.706

1k+ parts

-

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1,300

$2.081

$1.706

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AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$13.049

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557

$13.049

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One Stop Electronics

USA . 1,021 parts In-Stock

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$21.800

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1,021

$21.800

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Alle Elektronik GmbH

Germany . 4,989 parts In-Stock

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4,989

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Corphita

USA . 2,707 parts In-Stock

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2,707

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Overview

Elevate your audio experience with the LM4844TL from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability. This Audio Control IC is perfect for various applications, offering unparalleled sound clarity and channel separation of 84 dB. With a sleek rectangular package style and very thin profile, this volume control circuit provides seamless integration into your devices. Whether you're designing a new audio system or upgrading an existing one, the LM4844TL delivers outstanding performance and efficiency, making it the ideal choice for audio enthusiasts and professionals alike.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Channel Separation: 84 dB

Provides excellent audio quality with minimal signal interference between channels.

No. of Terminals: 30

Offers versatility and flexibility in circuit connections, allowing for various configurations.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high temperature environments, increasing product durability.

No. of Bands: 3

Allows for precise control over audio settings, providing a customized listening experience.

Width: 2.54 mm

Compact size enables space-saving design in electronic products.

Minimum Supply Voltage (Vsup): 2.7 V

Works efficiently with low power supply, making it suitable for battery-operated devices.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for reliability and performance in harsh operating conditions.

No. of Channels: 2

Ideal for stereo audio applications, providing a balanced audio experience.

Maximum Supply Voltage (Vsup): 5.5 V

Compatible with a wide range of power supplies, offering flexibility in system integration.

Technical Specifications

Audio Control ICs LM4844TL attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

84 dB

General IC Type:

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e0

Length:

2.949 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.54 mm

Trade Compliance

LM4844TL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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