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TDA7410

STMicroelectronics

TDA7410 by STMicroelectronics

TDA7410 by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 90 dB channel separation, operates b/w 7.5-10 V, and supports dual channels. Ideal for enhancing audio quality in consumer electronics, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,274 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,274

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-

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Anansix

USA . 1,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,349

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-

-

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Digiode

USA . 530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$1.492

100+ parts

-

1k+ parts

$1.343

10k+ parts

-

1,092

$1.492

-

$1.343

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MKK Technologies

India . 1,127 parts In-Stock

1+ parts

$2.806

100+ parts

-

1k+ parts

-

10k+ parts

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1,127

$2.806

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-

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DigiPath Technology Company

USA . 1,127 parts In-Stock

1+ parts

$2.806

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$2.806

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-

-

Corphita

USA . 2,515 parts In-Stock

1+ parts

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1k+ parts

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2,515

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Parana Technologies

USA . 1,738 parts In-Stock

1+ parts

-

100+ parts

$1.784

1k+ parts

-

10k+ parts

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1,738

-

$1.784

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Overview

Elevate your audio experience with the TDA7410 from STMicroelectronics—a leader in innovative technology. This versatile audio control IC offers exceptional sound quality and precision, ideal for home theaters, automotive systems, and portable devices. Its compact design ensures easy integration while delivering outstanding tone control and channel separation. Trust in STMicroelectronics' expertise to enhance your projects with reliability and performance that truly resonates!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stressors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability enables integration into compact designs, facilitating space-saving layouts in modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and optimal space utilization, making placement easier in circuit designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it offers enhanced audio customization, appealing to audiophiles and providing better user experience.

Channel Separation: 90 dB

High channel separation of 90 dB minimizes crosstalk and interference, resulting in clearer audio reproduction.

Power Supplies (V): 8.5

Operating at 8.5 V allows for compatibility with various audio systems, providing flexibility in integration.

No. of Terminals: 20

With 20 terminals, this IC offers extensive connectivity options for various control signals, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space is a premium, making it suitable for portable devices.

Maximum Operating Temperature: 80 °C

The ability to operate up to 80 °C ensures reliability in warmer environments and prolonged product lifespan.

No. of Bands: 2

Having 2 bands allows for different frequency adjustments, providing flexibility in audio tuning to fit diverse audio preferences.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this IC suitable for extreme conditions, ensuring functionality in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish improves conductivity and reduces oxidation, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions enhance layout flexibility on the PCB, allowing easier routing of signals.

Maximum Seated Height: 2.65 mm

A low seated height aids in achieving a low-profile design, essential for compact devices.

Width: 7.5 mm

The width of 7.5 mm is optimal for fitting in tight spaces within circuit boards, providing versatility in placement.

Minimum Supply Voltage (Vsup): 7.5 V

A minimum supply voltage of 7.5 V allows for broader compatibility with a variety of power supply systems.

Length: 12.8 mm

A manageable length of 12.8 mm ensures it fits well within most board layouts without requiring excessive space.

No. of Channels: 2

With 2 channels, this IC is effective for stereo applications, enhancing the audio experience.

Terminal Form: GULL WING

Gull wing terminal form provides good solderability and is a standard in surface mount technology, ensuring robust connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standardization and compatibility with various PCB layouts.

Maximum Supply Voltage (Vsup): 10 V

The maximum supply voltage of 10 V offers flexibility to users, allowing them to choose an appropriate voltage for their specific application.

Technical Specifications

Audio Control ICs TDA7410 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7410 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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