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LM1036MX/NOPB

Texas Instruments

LM1036MX/NOPB by Texas Instruments

LM1036MX/NOPB by Texas Instruments is an audio control IC with 20 terminals and a tone control circuit. Operating at 12V, it has a max supply current of 45mA. This small outline package is ideal for commercial temperature grade applications in audio systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,523 parts In-Stock

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Digiode

USA . 1,644 parts In-Stock

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Vyrian

USA . 1,184 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Parana Technologies

USA . 2,329 parts In-Stock

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$3.109

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$3.628

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$3.109

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Corohmni

South Africa . 340 parts In-Stock

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$3.165

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DigiPath Technology Company

USA . 1,524 parts In-Stock

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$3.423

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ChromeModa Solutions

Germany . 2,274 parts In-Stock

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$3.493

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$2.864

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

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$3.493

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$3.144

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AZTECH Wire

Italy . 349 parts In-Stock

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$6.994

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Ampacity Inc.

Singapore . 1,357 parts In-Stock

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$8.800

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One Stop Electronics

USA . 1,143 parts In-Stock

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$14.800

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QUARKTWIN TECHNOLOGY LTD

USA . 14,353 parts In-Stock

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Continental Prestige Electronics

USA . 5,507 parts In-Stock

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Perfect Parts

USA . 4,017 parts In-Stock

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Corphita

USA . 3,520 parts In-Stock

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Microchip USA

USA . 3,187 parts In-Stock

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Argo Parts USA

USA . 2,901 parts In-Stock

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Aranea Global

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Overview

Enhance your audio experience with the LM1036MX/NOPB by Texas Instruments, a top-tier manufacturer known for producing high-quality Audio Control ICs. Perfect for tone control circuits, this versatile small outline package offers customers the benefits of precise sound adjustments and easy surface mount installation. Whether you're looking to improve the audio quality in your home entertainment system or enhance the sound in your car stereo, the LM1036MX/NOPB delivers exceptional value and performance that will elevate your listening experience. Upgrade your audio setup today with Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs.

General IC Type: TONE CONTROL CIRCUIT

Specifically designed for tone control circuit applications, ensuring high performance and accuracy.

Power Supplies (V): 12

Operates on a standard 12V power supply, making it compatible with a wide range of audio systems.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the PCB and allows for efficient circuit layout.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and low noise performance, ideal for audio control applications.

Technical Specifications

Audio Control ICs LM1036MX/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

45 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM1036MX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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