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TDA7468D13TR

STMicroelectronics

TDA7468D13TR by STMicroelectronics

TDA7468D13TR from STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 90 dB channel separation, 0.01% harmonic distortion, and operates b/w 5-10 V. Ideal for enhancing sound quality in consumer electronics, it comes in a compact SO package.

Median Price

$272.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 500 parts In-Stock

1+ parts

$272.320

100+ parts

$265.320

1k+ parts

$259.350

10k+ parts

-

500

$272.320

$265.320

$259.350

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,844 parts In-Stock

1+ parts

$258.704

100+ parts

-

1k+ parts

-

10k+ parts

-

4,844

$258.704

-

-

-

Vyrian

USA . 8,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,649

-

-

-

-

Chip Stock

USA . 3,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,400

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-

-

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Anansix

USA . 570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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570

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,205 parts In-Stock

1+ parts

$1.358

100+ parts

-

1k+ parts

$1.222

10k+ parts

-

1,205

$1.358

-

$1.222

-

MKK Technologies

India . 1,313 parts In-Stock

1+ parts

$2.553

100+ parts

-

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-

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1,313

$2.553

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-

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DigiPath Technology Company

USA . 1,313 parts In-Stock

1+ parts

$2.553

100+ parts

-

1k+ parts

-

10k+ parts

-

1,313

$2.553

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-

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Microchip USA

USA . 154 parts In-Stock

1+ parts

$3.608

100+ parts

-

1k+ parts

-

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154

$3.608

-

-

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Component Stockers USA

USA . 2,901 parts In-Stock

1+ parts

$5.380

100+ parts

$5.110

1k+ parts

$4.950

10k+ parts

-

2,901

$5.380

$5.110

$4.950

-

AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$12.930

100+ parts

-

1k+ parts

-

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520

$12.930

-

-

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Corphita

USA . 3,497 parts In-Stock

1+ parts

$245.088

100+ parts

-

1k+ parts

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3,497

$245.088

-

-

-

Perfect Parts

USA . 25,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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25,760

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-

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A-Z Elektronik GmbH

Germany . 5,172 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,172

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-

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RC Electronics

USA . 5,068 parts In-Stock

1+ parts

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5,068

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Infinite Electronics LLP (Excess)

. 2,002 parts In-Stock

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2,002

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Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

-

100+ parts

$1.624

1k+ parts

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10k+ parts

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1,402

-

$1.624

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-

Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

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100+ parts

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600

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Kepictronics

USA . 140 parts In-Stock

1+ parts

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100+ parts

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140

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Overview

Elevate your audio experience with the TDA7468D13TR from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced audio control IC delivers superior tone management and exceptional sound quality, featuring impressive channel separation and minimal distortion. Ideal for consumer electronics, automotive systems, and professional audio equipment, it guarantees reliability and performance, ensuring your devices stand out in a competitive market. Embrace unparalleled audio excellence and bring out the best in every note!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and insulation, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, facilitating a more compact design.

Package Shape: RECTANGULAR

A rectangular package shape allows for straightforward integration onto standard circuit boards.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit IC, it allows for precise audio tuning, enhancing the overall sound quality.

Channel Separation: 90 dB

A high channel separation of 90 dB ensures minimal crosstalk between audio channels, providing clear stereo sound.

Harmonic Distortion: 0.01%

With a low harmonic distortion of 0.01%, this product guarantees high fidelity audio reproduction.

Power Supplies (V): 9

Operating on a 9V power supply makes it versatile and compatible with various audio applications.

No. of Terminals: 28

The 28 terminals allow for multiple functionalities and robust connections for better integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for compact designs in space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in typical operating environments.

No. of Bands: 2

Offering 2 bands allows users to customize the audio experience, making it suitable for various audio profiles.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC is suitable for diverse environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates flexibility in board layout and design options.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a reduced profile in assembly, useful for compact devices.

Width: 7.5 mm

The narrow width helps in fitting this IC into tight spaces on a circuit board.

Minimum Supply Voltage (Vsup): 5 V

Supporting a minimum supply voltage of 5V provides added flexibility for various power supply designs.

Maximum Time At Peak Reflow Temperature (s): 30

At a maximum reflow time of 30 seconds, it ensures safe PCB assembly without damaging the IC.

Peak Reflow Temperature (°C): 250

A peak reflow temperature of 250 °C meets standard soldering processes for reliable assembly.

Length: 17.9 mm

An optimal length allows for easy integration into various designs while maximizing functionality.

Temperature Grade: COMMERCIAL

Being commercially rated indicates this IC is suitable for general-purpose applications without extreme environmental considerations.

No. of Channels: 2

With 2 channels, this IC is ideal for stereo applications, enhancing sound experience.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS transistors, offering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and excellent mechanical strength on PCB.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard, allowing for compatibility with various circuit designs.

Moisture Sensitivity Level (MSL): 3

Being rated at moisture sensitivity level 3 indicates the product can withstand some moisture exposure, making it more durable.

Maximum Supply Voltage (Vsup): 10 V

Supporting a maximum of 10V supply voltage extends versatility for high-performance audio applications.

Technical Specifications

Audio Control ICs TDA7468D13TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7468D13TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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