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PGA8311PHPR

Texas Instruments

PGA8311PHPR by Texas Instruments

PGA8311PHPR by Texas Instruments is an Audio Control IC with 8 channels and 130 dB channel separation. It operates in industrial temperature range (-40 to 85 °C) with a supply voltage of 4.75-5.25 V. The package style is flatpack, suitable for volume control circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,160 parts In-Stock

1+ parts

-

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6,160

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Digiode

USA . 4,024 parts In-Stock

1+ parts

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4,024

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 727 parts In-Stock

1+ parts

$0.486

100+ parts

-

1k+ parts

$1.620

10k+ parts

-

727

$0.486

-

$1.620

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DigiPath Technology Company

USA . 1,598 parts In-Stock

1+ parts

$0.535

100+ parts

$0.492

1k+ parts

-

10k+ parts

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1,598

$0.535

$0.492

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ChromeModa Solutions

Germany . 2,430 parts In-Stock

1+ parts

$0.546

100+ parts

$0.448

1k+ parts

-

10k+ parts

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2,430

$0.546

$0.448

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IDEA Electronic Components Group

UK . 2,332 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

$0.491

10k+ parts

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2,332

$0.546

-

$0.491

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AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$12.661

100+ parts

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650

$12.661

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One Stop Electronics

USA . 788 parts In-Stock

1+ parts

$18.800

100+ parts

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788

$18.800

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Corphita

USA . 4,834 parts In-Stock

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4,834

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Overview

Experience superior audio control with the PGA8311PHPR by Texas Instruments, a cutting-edge solution for all your volume control needs. Crafted with precision and expertise, this high-quality audio control IC promises unmatched performance and reliability. Perfect for a wide range of applications, this product offers exceptional channel separation, ensuring crystal-clear sound. With its advanced technology and innovative design, the PGA8311PHPR delivers unparalleled value and benefits to customers, making it the ideal choice for all your audio control requirements. Elevate your audio experience with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space in electronic devices.

Channel Separation: 130 dB

High channel separation ensures clear and distinct audio output from each channel, resulting in superior sound quality.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and versatility in circuit design.

Maximum Operating Temperature: 85 °C

This high operating temperature range ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold conditions without risk of damage.

No. of Channels: 8

With 8 channels, this IC is suitable for applications requiring multi-channel audio control, offering flexibility in audio processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the IC.

Technical Specifications

Audio Control ICs PGA8311PHPR attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.75V TO 5.25V DIGITAL SUPPLY

Channel Separation:

130 dB

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

PGA8311PHPR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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