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TDA7302

STMicroelectronics

TDA7302 by STMicroelectronics

TDA7302 by STMicroelectronics is a Tone Control Circuit IC with 100 dB Channel Separation and 0.01% Harmonic Distortion. It has 2 bands, operates b/w -40 to 85 °C, and requires 6-14 V power supplies. Ideal for audio applications requiring precise tone control in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,151 parts In-Stock

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Bristol Electronics

USA . 1,255 parts In-Stock

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Anansix

USA . 884 parts In-Stock

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Vyrian

USA . 539 parts In-Stock

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R&J Components

USA . 130 parts In-Stock

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LittleDiode

UK . 10 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 206 parts In-Stock

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$1.939

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$1.745

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MKK Technologies

India . 1,224 parts In-Stock

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$3.647

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DigiPath Technology Company

USA . 1,224 parts In-Stock

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$3.647

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Corphita

USA . 607 parts In-Stock

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Kepictronics

USA . 429 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 98 parts In-Stock

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Parana Technologies

USA . 33 parts In-Stock

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$2.319

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Elevate your audio experience with the TDA7302 from STMicroelectronics, a leading manufacturer known for top-quality products. Designed for precise tone control, this audio control IC boasts exceptional channel separation and minimal harmonic distortion, ensuring crystal-clear sound output. Ideal for a wide range of applications, this compact and efficient device offers customers unmatched value and benefits. Upgrade your audio systems with the TDA7302 and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the IC, making it suitable for various applications.

General IC Type: TONE CONTROL CIRCUIT

The tone control circuit allows for adjustments to the audio output, providing a customizable listening experience for users.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio signals for each channel, resulting in high-quality audio performance.

Harmonic Distortion: 0.01 %

Low harmonic distortion ensures that the audio output is clean and accurate, without any unwanted noise or interference.

Power Supplies (V): 10

The 10V power supply allows for sufficient power to drive the IC and produce high-quality audio output.

No. of Terminals: 28

The 28 terminals provide connectivity options and flexibility for integrating the IC into various audio systems.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and space-efficient placement in audio control circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand extended periods of use without overheating.

No. of Bands: 2

The 2 bands allow for control over multiple frequencies, offering versatility in tone adjustment for the audio output.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the IC can function reliably in cold environments or during temperature fluctuations.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good electrical conductivity and solderability, ensuring secure connections for the IC.

Technology: BIPOLAR

The bipolar technology used in the IC offers high performance and accuracy in audio signal processing, leading to improved sound quality.

Technical Specifications

Audio Control ICs TDA7302 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.83 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA7302 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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