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LM4835MDC

Texas Instruments

LM4835MDC by Texas Instruments

Texas Instruments' LM4835MDC is a 2-channel volume control circuit with 65 dB channel separation. Operating from -40 to 85°C, it accepts supply voltages from 2.7V to 5.5V. Ideal for industrial applications requiring precise audio control in a surface-mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,885 parts In-Stock

1+ parts

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3,885

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Anansix

USA . 2,488 parts In-Stock

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2,488

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Digiode

USA . 2,141 parts In-Stock

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2,141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 72 parts In-Stock

1+ parts

$3.039

100+ parts

-

1k+ parts

$3.553

10k+ parts

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72

$3.039

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$3.553

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IDEA Electronic Components Group

UK . 344 parts In-Stock

1+ parts

$3.415

100+ parts

-

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$3.074

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344

$3.415

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$3.074

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ChromeModa Solutions

Germany . 44 parts In-Stock

1+ parts

$3.415

100+ parts

$2.800

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44

$3.415

$2.800

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AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$5.739

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204

$5.739

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One Stop Electronics

USA . 1,409 parts In-Stock

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$13.800

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1,409

$13.800

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DigiPath Technology Company

USA . 1,585 parts In-Stock

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$3.079

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1,585

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$3.079

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Corphita

USA . 852 parts In-Stock

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852

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Overview

Elevate your audio experience with the LM4835MDC by Texas Instruments, a premium quality Audio Control IC designed to deliver exceptional sound performance. Manufactured by industry leader Texas Instruments, this versatile chip offers unparalleled channel separation and precise volume control for a truly immersive listening experience. Ideal for a wide range of applications, from portable devices to home entertainment systems, the LM4835MDC provides superior audio quality and reliability. Upgrade your audio system today with the LM4835MDC and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, saving space and streamlining the production process.

Channel Separation: 65 dB

With a high channel separation of 65 dB, this product ensures clear audio quality with minimized crosstalk between channels.

Package Style (Meter): UNCASED CHIP

The unencased chip package style allows for flexibility in terms of mounting options and simplifies the design layout.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7 V allows for operation in power-constrained applications.

No. of Channels: 2

With two channels, this product is suitable for stereo audio applications, providing control over multiple audio channels.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring compatibility with various systems.

Technical Specifications

Audio Control ICs LM4835MDC attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Channels:

2

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LM4835MDC General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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