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TDA744813TR

STMicroelectronics

TDA744813TR by STMicroelectronics

TDA744813TR by STMicroelectronics is a versatile audio control IC designed for volume management in various applications. It features 90 dB channel separation, 0.01% harmonic distortion, and operates b/w 4.75V to 10V. Ideal for compact audio systems, it ensures high-quality sound performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,028 parts In-Stock

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8,028

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 1,555 parts In-Stock

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1,555

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Digiode

USA . 1,529 parts In-Stock

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1,529

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Kiltronic GmbH

Germany . 591 parts In-Stock

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591

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Zilex Electronics Inc.

Canada . 57 parts In-Stock

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

1+ parts

$2.835

100+ parts

-

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$2.551

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1,543

$2.835

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$2.551

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MKK Technologies

India . 610 parts In-Stock

1+ parts

$5.330

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610

$5.330

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DigiPath Technology Company

USA . 610 parts In-Stock

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$5.330

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610

$5.330

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AZTECH Wire

Italy . 685 parts In-Stock

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$9.840

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685

$9.840

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QUARKTWIN TECHNOLOGY LTD

USA . 17,492 parts In-Stock

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RC Electronics

USA . 15,430 parts In-Stock

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Perfect Parts

USA . 5,089 parts In-Stock

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Microchip USA

USA . 4,754 parts In-Stock

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Corphita

USA . 3,411 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,988 parts In-Stock

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$3.389

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$3.389

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Metaverse IC Inc.

Canada . 568 parts In-Stock

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568

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Overview

Elevate your audio experience with the TDA744813TR from STMicroelectronics, a trusted leader in innovative technology. Designed for superior volume control, this compact audio control IC promises exceptional sound quality and impressive channel separation, making it ideal for high-fidelity applications. With ST's commitment to reliability and performance, you gain access to cutting-edge solutions that enhance your products' value and delight your customers. Experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material is lightweight and offers good moisture resistance, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design, facilitating easy integration into modern electronic devices and saving valuable board space.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on the PCB, making it easier to arrange in dense layouts.

General IC Type: VOLUME CONTROL CIRCUIT

This IC type is specifically designed for effective audio volume control, ensuring high-quality sound management in audio systems.

Channel Separation: 90 dB

With a channel separation of 90 dB, this IC minimizes crosstalk between channels, resulting in clearer and more distinct audio output.

Harmonic Distortion: 0.01 %

The low harmonic distortion rate ensures high fidelity sound reproduction, making it ideal for high-quality audio applications.

Power Supplies (V): 9

Operating at 9V, this IC is compatible with various standard power supply configurations, making it versatile for different audio applications.

No. of Terminals: 20

A 20-terminal configuration allows for multiple connections and functions, enhancing the device's capabilities and flexibility in use.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables more compact designs, ideal for portable or space-constrained audio equipment.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature makes this IC suitable for use in varied temperature environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

Starting from a minimum temperature of 0 °C allows this IC to function in a wide range of environments, suitable for indoor and outdoor devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish ensures excellent solderability and improves durability, leading to enhanced long-term performance.

Terminal Position: DUAL

With dual terminal positioning, this IC provides greater installation flexibility and ease of integration into various circuit designs.

Maximum Seated Height: 2.65 mm

The low seated height aids in designing low-profile devices, which is beneficial for sleek audio equipment.

Width: 7.5 mm

A compact width of 7.5 mm contributes to space-saving designs, allowing for more circuitry in limited hardware space.

Minimum Supply Voltage (Vsup): 4.75 V

The ability to function at a minimum supply voltage of 4.75 V enhances its compatibility with various power sources and battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing up to 30 seconds at peak reflow temperature ensures reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with modern surface mount technology handling and enhances production efficiency.

Length: 12.8 mm

The compact length further contributes to the overall slim design of devices, making it ideal for modern audio applications.

Temperature Grade: COMMERCIAL

Designed for commercial temperature grades, this IC can operate reliably in standard consumer environments, ensuring widespread usability.

No. of Channels: 6

With six channels, this IC supports complex audio applications, making it suitable for multi-channel audio setups or advanced audio systems.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS processes, resulting in improved performance and energy efficiency.

Terminal Form: GULL WING

Gull wing terminal form allows for easy handling and positioning during assembly, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a compact layout while ensuring ease of soldering and assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, making proper handling necessary, and ensuring durability in operational conditions.

Maximum Supply Voltage (Vsup): 10 V

A maximum supply voltage of 10 V allows flexibility in power supply options, making it adaptable for various audio equipment designs.

Technical Specifications

Audio Control ICs TDA744813TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA744813TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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