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KAC-12040-ABA-JD-AA

Onsemi

KAC-12040-ABA-JD-AA by Onsemi

The Onsemi KAC-12040-ABA-JD-AA is an image sensor with 4.70x4.70 um pixel size, 50 MHz master clock, and 2.1V max supply voltage. Ideal for digital cameras, machine vision systems, and industrial imaging applications due to its high resolution and fast frame rate capabilities at 70 fps.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,502 parts In-Stock

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Vyrian

USA . 1,001 parts In-Stock

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Kulean Microsystems

USA . 6,459 parts In-Stock

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TANS Electronics

Latvia . 6,259 parts In-Stock

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SupplyDigital Components

Austria . 5,789 parts In-Stock

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Problanco Electronics

Mexico . 2,742 parts In-Stock

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Corphita

USA . 1,014 parts In-Stock

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UHIMA Technologies

Türkiye . 880 parts In-Stock

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Corohmni

South Africa . 138 parts In-Stock

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Overview

Elevate your imaging experience with the KAC-12040-ABA-JD-AA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that exceed expectations. Ideal for a wide range of applications, this sensor offers unparalleled value, providing customers with stunning image quality, enhanced performance, and reliability. Say goodbye to blurry images and hello to crystal-clear visuals with the KAC-12040-ABA-JD-AA - the perfect choice for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 4.70X4.70

Larger pixel size allows for better light sensitivity and higher image quality

Maximum Supply Voltage: 2.1 V

Higher supply voltage allows for better performance and flexibility in power supply design

Master Clock: 50 MHz

High master clock frequency enables fast data readout and processing

Body Width: 38.1 inch

Compact body width enables easy integration into different devices

Power Supplies (V): 2

Dual power supply provides redundancy and stability in operation

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers low power consumption and high image quality

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for efficient layout and space utilization

Minimum Supply Voltage: 1.9 V

Low minimum supply voltage helps in energy efficiency and extended battery life

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures reliability in various environmental conditions

Horizontal Pixel: 4000

High horizontal pixel count offers detailed and high-resolution images

Output Range: 0.45-1.55V

Wide output voltage range provides flexibility in signal processing

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies interface with other digital systems

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for use in cold environments

Housing: CERAMIC

Ceramic housing offers durability and protection for the sensor components

Dynamic Range: 72 dB

High dynamic range enables capturing both bright and dark areas with detail

Vertical Pixel: 3000

High vertical pixel count complements horizontal resolution for better overall image quality

Body Length/Diameter: 42.5 mm

Compact body length allows for easy installation and integration into devices

Optical Format (inch): 4/3

Standard optical format for compatibility with various lenses and imaging systems

Termination Type: SOLDER

Solder termination ensures secure electrical connections for reliable operation

Output Interface Type: 4-WIRE INTERFACE

4-wire interface simplifies connectivity and data transfer to external systems

Frame Rate: 70 fps

High frame rate allows for smooth and fast video recording and real-time imaging

Array Type: FRAME

Frame array design offers flexibility in capturing and processing image frames

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure and stable installation in various devices

Technical Specifications

Image Sensors KAC-12040-ABA-JD-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 1.71 TO 1.89 V, GLOBAL SHUTTER, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

38.1 inch

Body Length/Diameter:

42.5 mm

Dynamic Range:

72 dB

Frame Rate:

70 fps

Horizontal Pixel:

4000

Housing:

CERAMIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Optical Format (inch):

4/3

Output Interface Type:

4-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

4.70X4.70

Power Supplies (V):

2

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

2.1 V

Minimum Supply Voltage:

1.9 V

Termination Type:

SOLDER

Vertical Pixel:

3000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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