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KAC-12040-CBA-JD-BA

Onsemi

KAC-12040-CBA-JD-BA by Onsemi

KAC-12040-CBA-JD-BA by Onsemi is an image sensor with 4.70x4.70 um pixel size, 50 MHz master clock, and 4000 horizontal pixels. It is used in applications requiring a digital voltage output interface, such as frame arrays with a 70 fps frame rate for high-quality imaging.

Median Price

$2,796.995

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$1,070.580

100+ parts

$1,006.350

1k+ parts

$942.110

10k+ parts

-

3

$1,070.580

$1,006.350

$942.110

-

DigiKey

USA . 3 parts In-Stock

1+ parts

$1,183.090

100+ parts

-

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3

$1,183.090

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Arrow

USA . 29 parts In-Stock

1+ parts

$4,410.900

100+ parts

$3,562.650

1k+ parts

-

10k+ parts

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29

$4,410.900

$3,562.650

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-

Verical

USA . 29 parts In-Stock

1+ parts

$4,410.900

100+ parts

$3,562.650

1k+ parts

-

10k+ parts

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29

$4,410.900

$3,562.650

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,743 parts In-Stock

1+ parts

$917.358

100+ parts

-

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1,743

$917.358

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Vyrian

USA . 4,595 parts In-Stock

1+ parts

-

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4,595

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ACDS - Activité Composants Distribution Service

France . 27 parts In-Stock

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27

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,652 parts In-Stock

1+ parts

$869.076

100+ parts

-

1k+ parts

-

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1,652

$869.076

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Corohmni

South Africa . 117 parts In-Stock

1+ parts

$965.640

100+ parts

-

1k+ parts

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117

$965.640

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$965.640

100+ parts

-

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3

$965.640

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Kulean Microsystems

USA . 8,102 parts In-Stock

1+ parts

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8,102

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SupplyDigital Components

Austria . 7,456 parts In-Stock

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7,456

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TANS Electronics

Latvia . 4,219 parts In-Stock

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4,219

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Problanco Electronics

Mexico . 4,018 parts In-Stock

1+ parts

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4,018

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UHIMA Technologies

Türkiye . 903 parts In-Stock

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903

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Perfect Parts

USA . 60 parts In-Stock

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60

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Cyclops Electronics Ltd (Excess)

UK . 27 parts In-Stock

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27

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Overview

Discover the cutting-edge technology of the KAC-12040-CBA-JD-BA by Onsemi, a top-of-the-line image sensor that promises unparalleled performance and quality. With a wide range of applications in industries such as automotive, security, and medical imaging, this sensor offers customers unmatched value and benefits. Experience crystal-clear imaging, precise data collection, and seamless integration with its state-of-the-art features. Trust in Onsemi's reputation for innovation and reliability, and unlock new possibilities with the KAC-12040-CBA-JD-BA.

Feature Benefit Bullets

Pixel Size (um) 4.70X4.70

Larger pixel size allows for better light sensitivity and improved image quality

Maximum Supply Voltage 2.1 V

Low maximum supply voltage helps in power efficiency and reduces the risk of damage to the sensor

Master Clock 50 MHz

High master clock frequency enables fast processing and high frame rates

Body Width 38.1 inch

Compact body width makes the sensor easy to integrate into various devices

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS technology provides low power consumption and high-quality images

Package Shape or Style RECTANGULAR

Rectangular package shape allows for easy mounting and integration

Minimum Supply Voltage 1.9 V

Low minimum supply voltage ensures reliable operation even in low-power scenarios

Maximum Operating Temperature 80 °C

Wide operating temperature range makes the sensor suitable for various environments

Horizontal Pixel 4000

High horizontal pixel count provides detailed and high-resolution images

Output Range 0.45-1.55V

Wide output voltage range allows for flexibility in signal processing and compatibility with different systems

Output Type DIGITAL VOLTAGE

Digital output simplifies data processing and transmission

Minimum Operating Temperature -20 °C

Low minimum operating temperature ensures reliable performance even in cold conditions

Housing CERAMIC

Ceramic housing provides durability and protection for the sensor

Dynamic Range 73 dB

High dynamic range allows for capturing both bright and dark areas in a scene with detail

Vertical Pixel 3000

High vertical pixel count contributes to capturing detailed images with good resolution

Body Length/Diameter 42.5 mm

Compact body length/diameter facilitates easy integration and reduces space requirements

Optical Format (inch) 4/3

Standard 4/3 optical format ensures compatibility with various lenses and imaging systems

Termination Type SOLDER

Solder termination provides a secure connection and ensures reliable signal transmission

Output Interface Type SPI INTERFACE

SPI interface allows for easy communication with other devices and systems

Frame Rate 70 fps

High frame rate enables capturing fast-moving objects and smooth video recording

Array Type FRAME

Frame array type provides flexibility in capturing different types of images and scenes

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature facilitates secure and stable installation of the sensor

Technical Specifications

Image Sensors KAC-12040-CBA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 1.71 TO 1.89 V, GLOBAL SHUTTER, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

38.1 inch

Body Length/Diameter:

42.5 mm

Dynamic Range:

73 dB

Frame Rate:

70 fps

Horizontal Pixel:

4000

Housing:

CERAMIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Optical Format (inch):

4/3

Output Interface Type:

SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

4.70X4.70

Sensors or Transducers Type:

Maximum Supply Voltage:

2.1 V

Minimum Supply Voltage:

1.9 V

Termination Type:

SOLDER

Vertical Pixel:

3000

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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