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HGT1S7N60B3DS

Onsemi

HGT1S7N60B3DS by Onsemi

HGT1S7N60B3DS by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a max IC of 14A. It is designed for power control applications, featuring a built-in diode and small outline package style. With a collector-emitter voltage of 600V and operating temperature range from -55 to 150 °C, it offers efficient performance in various power management systems.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

50

-

$1.390

$1.150

$1.030

Distributors (In-Stock)

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Digiode

USA . 1,226 parts In-Stock

1+ parts

$1.083

100+ parts

-

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1,226

$1.083

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Vyrian

USA . 8,861 parts In-Stock

1+ parts

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8,861

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

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60

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Distributors (Availability)

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Native Components

USA . 58 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

-

10k+ parts

$0.093

58

$0.097

-

-

$0.093

Northwest PG Solutions

USA . 1,241 parts In-Stock

1+ parts

$0.107

100+ parts

-

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-

10k+ parts

$0.094

1,241

$0.107

-

-

$0.094

Corphita

USA . 1,868 parts In-Stock

1+ parts

$1.026

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1,868

$1.026

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Corohmni

South Africa . 499 parts In-Stock

1+ parts

$1.140

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499

$1.140

-

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Andel Nordic

Denmark . 5,382 parts In-Stock

1+ parts

$10.772

100+ parts

-

1k+ parts

$10.341

10k+ parts

$10.341

5,382

$10.772

-

$10.341

$10.341

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,698 parts In-Stock

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9,698

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Problanco Electronics

Mexico . 7,985 parts In-Stock

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7,985

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Kulean Microsystems

USA . 7,909 parts In-Stock

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7,909

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A-Z Elektronik GmbH

Germany . 4,641 parts In-Stock

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4,641

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Alle Elektronik GmbH

Germany . 3,094 parts In-Stock

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3,094

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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1,740

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Supply Digital

USA . 1,280 parts In-Stock

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1,280

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SupplyDigital Components

Austria . 1,261 parts In-Stock

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1,261

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TANS Electronics

Latvia . 460 parts In-Stock

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460

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UHIMA Technologies

Türkiye . 214 parts In-Stock

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214

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Overview

Discover the innovative HGT1S7N60B3DS by Onsemi, a top-tier Insulated Gate Bipolar Transistor designed for power control applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unparalleled performance and reliability. Experience the value of its 600V maximum collector-emitter voltage and 14A maximum collector current, ensuring efficient power management. Trust in Onsemi's reputation for quality and precision engineering, making the HGT1S7N60B3DS the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, extending the lifespan of the IGBT.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the IGBT.

Transistor Application: POWER CONTROL

Ideal for applications requiring precise control over power outputs, ensuring efficient performance.

Maximum VCEsat: 2.1 V

Low VCEsat minimizes power losses in the IGBT during operation, improving overall efficiency.

Maximum Fall Time (tf): 175 ns

Fast fall time enhances the switching speed of the IGBT, making it suitable for high-frequency applications.

Maximum Power Dissipation (Abs): 60 W

Capable of handling high power levels, suitable for demanding applications that require high power output.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures stable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating allows the IGBT to handle high voltages, making it versatile in different applications.

Maximum Gate-Emitter Voltage: 20 V

Ensures safe and reliable gate control, preventing damage to the IGBT during operation.

Maximum Collector Current (IC): 14 A

High collector current rating allows the IGBT to handle large currents, suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S7N60B3DS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

175 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

470 ns

Nominal Turn Off Time (toff):

350 ns

Nominal Turn On Time (ton):

46 ns

Maximum VCEsat:

2.1 V

Trade Compliance

HGT1S7N60B3DS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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