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FJPF3305H2TU

Onsemi

FJPF3305H2TU by Onsemi

NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): 4 A; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;

Median Price

$0.604

Lifecycle Status

EOL

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 300 parts In-Stock

1+ parts

$0.319

100+ parts

-

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300

$0.319

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Mouser Electronics

USA . 802 parts In-Stock

1+ parts

$0.500

100+ parts

$0.498

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802

$0.500

$0.498

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Rochester

USA . 233,300 parts In-Stock

1+ parts

-

100+ parts

$0.709

1k+ parts

$0.588

10k+ parts

$0.524

233,300

-

$0.709

$0.588

$0.524

DigiKey

USA . 126,503 parts In-Stock

1+ parts

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$0.890

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126,503

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$0.890

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Farnell

UK . 126,503 parts In-Stock

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$0.735

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126,503

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$0.735

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Flip Electronics (Authorized)

USA . 1,268 parts In-Stock

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1,268

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Chip1Stop

Japan . 980 parts In-Stock

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Verical

USA . 300 parts In-Stock

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$0.319

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300

-

$0.319

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Distributors (In-Stock)

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Digiode

USA . 2,713 parts In-Stock

1+ parts

$0.303

100+ parts

-

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2,713

$0.303

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Vyrian

USA . 1,042 parts In-Stock

1+ parts

$0.319

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1,042

$0.319

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DF Sales Co.

USA . 87 parts In-Stock

1+ parts

$0.448

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87

$0.448

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DF Sales Co.

USA . 87 parts In-Stock

1+ parts

$0.448

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87

$0.448

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DigiKey Marketplace

USA . 127,000 parts In-Stock

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127,000

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Flip Electronics

USA . 1,268 parts In-Stock

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1,268

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Lakeview Electronics

USA . 280 parts In-Stock

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280

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Distributors (Availability)

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Ampacity Inc.

Singapore . 54,333 parts In-Stock

1+ parts

$0.271

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54,333

$0.271

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Corphita

USA . 2,922 parts In-Stock

1+ parts

$0.287

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2,922

$0.287

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Corohmni

South Africa . 489 parts In-Stock

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$0.319

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489

$0.319

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Component Stockers USA

USA . 229,723 parts In-Stock

1+ parts

$0.320

100+ parts

$0.320

1k+ parts

$0.510

10k+ parts

$0.510

229,723

$0.320

$0.320

$0.510

$0.510

Microchip USA

USA . 2,387 parts In-Stock

1+ parts

$9.035

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2,387

$9.035

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Continental Prestige Electronics

USA . 127,000 parts In-Stock

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$0.567

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$0.567

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Lixinc

USA . 15,508 parts In-Stock

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15,508

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A-Z Elektronik GmbH

Germany . 5,828 parts In-Stock

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5,828

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,969 parts In-Stock

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SupplyDigital Components

Austria . 3,444 parts In-Stock

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Perfect Parts

USA . 2,760 parts In-Stock

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2,760

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Kulean Microsystems

USA . 2,745 parts In-Stock

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TANS Electronics

Latvia . 2,540 parts In-Stock

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Northwest PG Solutions

USA . 2,174 parts In-Stock

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2,174

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Supply Digital

USA . 1,083 parts In-Stock

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1,083

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Native Components

USA . 698 parts In-Stock

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698

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UHIMA Technologies

Türkiye . 631 parts In-Stock

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631

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Technical Specifications

Power Bipolar Junction Transistors (BJT) FJPF3305H2TU attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

4 A

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

26

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FJPF3305H2TU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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