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BUV21G

Onsemi

BUV21G by Onsemi

BUV21G by Onsemi is a NPN Power BJT with 200V VCE, 40A IC, and 250W Ptot. Ideal for switching applications, it has a hFE of 10 and operates up to 200°C. The transistor's package style is flange mount with a round shape and collector case connection.

Median Price

$21.700

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 75 parts In-Stock

1+ parts

$18.350

100+ parts

$10.630

1k+ parts

$10.420

10k+ parts

-

75

$18.350

$10.630

$10.420

-

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$21.700

100+ parts

$13.020

1k+ parts

-

10k+ parts

-

120

$21.700

$13.020

-

-

DigiKey

USA . 99 parts In-Stock

1+ parts

$21.700

100+ parts

$12.536

1k+ parts

-

10k+ parts

-

99

$21.700

$12.536

-

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Newark

USA . 75 parts In-Stock

1+ parts

$22.280

100+ parts

$12.910

1k+ parts

-

10k+ parts

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75

$22.280

$12.910

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Element14

Singapore . 75 parts In-Stock

1+ parts

$31.010

100+ parts

$18.120

1k+ parts

$17.760

10k+ parts

-

75

$31.010

$18.120

$17.760

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Rochester

USA . 12,503 parts In-Stock

1+ parts

-

100+ parts

$12.540

1k+ parts

$11.220

10k+ parts

$10.560

12,503

-

$12.540

$11.220

$10.560

Verical

USA . 11,948 parts In-Stock

1+ parts

-

100+ parts

$15.675

1k+ parts

$14.025

10k+ parts

$13.200

11,948

-

$15.675

$14.025

$13.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,050 parts In-Stock

1+ parts

$13.234

100+ parts

-

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-

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2,050

$13.234

-

-

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TME

Poland . 91 parts In-Stock

1+ parts

$19.840

100+ parts

-

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-

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91

$19.840

-

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Vyrian

USA . 5,272 parts In-Stock

1+ parts

-

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5,272

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Flip Electronics

USA . 400 parts In-Stock

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400

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DigiKey Marketplace

USA . 100 parts In-Stock

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-

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100

-

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

1+ parts

-

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 204 parts In-Stock

1+ parts

$6.049

100+ parts

-

1k+ parts

$5.807

10k+ parts

$5.807

204

$6.049

-

$5.807

$5.807

Corphita

USA . 1,163 parts In-Stock

1+ parts

$12.537

100+ parts

-

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1,163

$12.537

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Corohmni

South Africa . 260 parts In-Stock

1+ parts

$13.930

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260

$13.930

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Continental Prestige Electronics

USA . 82 parts In-Stock

1+ parts

$17.140

100+ parts

$13.020

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-

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82

$17.140

$13.020

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TANS Electronics

Latvia . 6,617 parts In-Stock

1+ parts

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6,617

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SupplyDigital Components

Austria . 6,067 parts In-Stock

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6,067

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Kulean Microsystems

USA . 5,748 parts In-Stock

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5,748

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Kepictronics

USA . 4,795 parts In-Stock

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4,795

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Northwest PG Solutions

USA . 2,349 parts In-Stock

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2,349

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Perfect Parts

USA . 864 parts In-Stock

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864

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Native Components

USA . 580 parts In-Stock

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580

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UHIMA Technologies

Türkiye . 287 parts In-Stock

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287

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Problanco Electronics

Mexico . 192 parts In-Stock

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192

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Assy Fe

Spain . 10 parts In-Stock

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10

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Overview

Power up your projects with the BUV21G from Onsemi, a reliable and high-quality Power Bipolar Junction Transistor perfect for switching applications. Designed with a single NPN configuration and a maximum collector current of 40 A, this transistor offers exceptional performance and durability. The flange mount package body material ensures optimal heat dissipation, while the tin-silver-copper finish guarantees strong connectivity. Whether you're working on industrial equipment or automotive systems, the BUV21G is the ideal choice for your power needs. Experience the superior value and benefits that Onsemi products bring to your projects today.

Feature Benefit Bullets

Package Body Material: METAL

Metal package provides good thermal conductivity and mechanical strength, ensuring reliable performance and durability.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, making this transistor versatile in various applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient control of current flow.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability allows for handling larger loads and ensures reliability in high-power applications.

Maximum Collector-Emitter Voltage: 200 V

With a high voltage rating, this transistor can be used in applications requiring higher voltages.

Maximum Collector Current (IC): 40 A

High collector current rating enables this transistor to handle large currents, making it suitable for high-power applications.

Nominal Transition Frequency (fT): 8 MHz

High transition frequency allows for fast switching speeds, making it ideal for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUV21G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

200 V

Configuration:

Minimum DC Current Gain (hFE):

10

JEDEC-95 Code:

TO-204AE

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BUV21G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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