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BUV21

Onsemi

BUV21 by Onsemi

BUV21 by Onsemi is a NPN Power BJT with 200V VCE, 40A IC, and 250W Ptot. Ideal for switching applications, it has a single configuration in a round package with flange mount style. With hFE of 10 and fT of 8MHz, it operates up to 200 °C making it suitable for high-power tasks.

Median Price

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Lifecycle Status

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Vyrian

USA . 3,126 parts In-Stock

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Anansix

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Digiode

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ECAB

Sweden . 421 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 98 parts In-Stock

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Huijzer Components

Netherlands . 33 parts In-Stock

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LittleDiode

UK . 21 parts In-Stock

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Q Components

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Corel Iberica Componentes, S.L.

Spain . 15 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Odyssey Electronics LTD

USA . 5 parts In-Stock

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GES GmbH

Germany . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 2,149 parts In-Stock

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$1.555

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$1.399

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MKK Technologies

India . 1,925 parts In-Stock

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DigiPath Technology Company

USA . 1,925 parts In-Stock

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SupplyDigital Components

Austria . 5,175 parts In-Stock

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TANS Electronics

Latvia . 4,637 parts In-Stock

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Corphita

USA . 3,859 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Kulean Microsystems

USA . 3,553 parts In-Stock

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Problanco Electronics

Mexico . 2,132 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Northwest PG Solutions

USA . 1,970 parts In-Stock

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Native Components

USA . 1,466 parts In-Stock

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UHIMA Technologies

Türkiye . 750 parts In-Stock

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Corohmni

South Africa . 493 parts In-Stock

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Parana Technologies

USA . 347 parts In-Stock

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Assy Fe

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Overview

Unlock the power of innovation with the BUV21 by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Bipolar Junction Transistors (BJT) are known for their superior quality and reliability. Ideal for switching applications, the BUV21 offers a seamless performance with a maximum collector-emitter voltage of 200V and a nominal transition frequency of 8MHz. With a maximum power dissipation of 250W and a maximum collector current of 40A, this NPN transistor is designed to deliver exceptional results. Elevate your projects with the BUV21 and experience the difference that Onsemi's cutting-edge technology can make.

Feature Benefit Bullets

Package Body Material: METAL

Metal packages provide good thermal conductivity, ensuring efficient heat dissipation and improving overall reliability of the transistor.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching applications, making them versatile and widely applicable.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity, making it easier to integrate this transistor into various electronic systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast and efficient switching performance for improved system efficiency.

Package Shape: ROUND

Round packages are compact and space-saving, allowing for easy mounting and integration into tight spaces or on crowded PCBs.

Terminal Form: PIN/PEG

PIN/PEG terminals provide secure and reliable connections, ensuring stable operation and reducing the risk of signal loss or interference.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capabilities enable this transistor to handle high current and voltage levels, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages offer easy installation and secure mounting, enhancing the robustness and durability of the transistor in various environments.

Minimum DC Current Gain (hFE): 10

A minimum DC current gain of 10 ensures reliable amplification and control, making this transistor suitable for a wide range of signal processing tasks.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature of 200 °C, this transistor can withstand elevated temperatures without compromising its performance or reliability.

Maximum Collector-Emitter Voltage: 200 V

A high maximum collector-emitter voltage rating of 200V ensures safe and reliable operation in high voltage circuits, enhancing the transistor's versatility.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent performance characteristics, including high gain and low leakage, making them ideal for a wide range of electronic applications.

Maximum Collector Current (IC): 40 A

With a maximum collector current rating of 40A, this transistor can handle high current loads without overheating or performance degradation.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability and ease of assembly.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process and reducing the risk of damage during installation.

Case Connection: COLLECTOR

Collector case connection simplifies circuit design and layout, making it easier to connect the transistor in various configurations and applications.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235 °C ensures reliable solder joints and secure connections during assembly, enhancing the overall durability and performance of the transistor.

Nominal Transition Frequency (fT): 8 MHz

A high nominal transition frequency of 8MHz indicates fast response times and high-frequency operation, making this transistor suitable for high-speed switching applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUV21 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

200 V

Configuration:

Minimum DC Current Gain (hFE):

10

JEDEC-95 Code:

TO-204AE

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BUV21 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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