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BUV24

STMicroelectronics

BUV24 by STMicroelectronics

STMicroelectronics BUV24 is a NPN power BJT with max VCEsat of 1V, IC of 20A, and Ptot of 250W. Ideal for switching applications, it has a hFE of 8, fT of 8MHz, and can operate up to 200 °C. Package style is flange mount with round shape and tin lead finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,596 parts In-Stock

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Anansix

USA . 1,478 parts In-Stock

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Vyrian

USA . 1,410 parts In-Stock

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ECAB

Sweden . 347 parts In-Stock

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347

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ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

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LWI Electronics Inc

India . 43 parts In-Stock

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LittleDiode

UK . 17 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 15 parts In-Stock

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Huijzer Components

Netherlands . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 1,571 parts In-Stock

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$0.599

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$0.539

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MKK Technologies

India . 68 parts In-Stock

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$1.126

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DigiPath Technology Company

USA . 68 parts In-Stock

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$1.126

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,368 parts In-Stock

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Parana Technologies

USA . 730 parts In-Stock

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Native Components

USA . 262 parts In-Stock

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Northwest PG Solutions

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Assy Fe

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Overview

Elevate your power management capabilities with the BUV24 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Bipolar Junction Transistors that excel in switching applications. With a maximum VCEsat of 1V and a maximum collector current of 20A, this NPN transistor offers exceptional performance and reliability. Whether you're designing industrial equipment or automotive systems, the BUV24 provides the power and efficiency you need to optimize your operations. Trust STMicroelectronics to provide value, benefits, and advantages that exceed your expectations. Experience the difference with the BUV24 today.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides excellent heat dissipation, ensuring the transistor operates at optimal temperatures for maximum efficiency and reliability.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching applications, making this product versatile for a variety of circuit designs.

Configuration: SINGLE

Single configuration makes it easy to integrate into circuits and simplifies the overall design process.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast switching speeds and efficient power management.

Maximum VCEsat: 1 V

Low VCEsat value indicates minimal power loss and high efficiency in switching operations.

Package Shape: ROUND

Round package shape allows for easy mounting and installation in various electronic devices.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure connections for reliable electrical contact.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and reduces complexity in wiring.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability ensures the transistor can handle large amounts of power without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy mounting and secure attachment to circuit boards or heat sinks.

Maximum Power Dissipation Ambient: 250 W

With a maximum ambient power dissipation of 250W, this transistor can operate efficiently even in challenging environmental conditions.

Minimum DC Current Gain (hFE): 8

Minimum DC current gain of 8 ensures reliable amplification and switching performance in various applications.

Maximum Operating Temperature: 200 °C

High maximum operating temperature of 200 °C allows the transistor to be used in a wide range of operating conditions without performance degradation.

Maximum Collector-Emitter Voltage: 400 V

400V maximum collector-emitter voltage provides high voltage tolerance, making it suitable for applications requiring higher voltage handling capabilities.

Transistor Element Material: SILICON

Silicon-based transistor element material offers high durability and reliability for long-term performance.

Maximum Turn On Time (ton): 1600 ns

Fast turn-on time of 1600ns ensures quick response in switching applications, reducing power losses and improving efficiency.

Maximum Collector Current (IC): 20 A

High collector current rating of 20A allows the transistor to handle large currents, making it suitable for high-power applications.

Maximum Turn Off Time (toff): 4400 ns

Extended turn-off time of 4400ns ensures smooth switching transitions and minimizes any potential voltage spikes.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides corrosion resistance and ensures long-term reliability in various environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies the mounting and connection process, making it easier to integrate into circuit designs.

Case Connection: COLLECTOR

Case connection at the collector terminal enhances thermal conductivity and helps dissipate heat efficiently for improved performance.

Nominal Transition Frequency (fT): 8 MHz

High transition frequency of 8MHz ensures fast switching speeds and excellent high-frequency performance in amplification and switching applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUV24 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

8

JEDEC-95 Code:

TO-3

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

250 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

4400 ns

Maximum Turn On Time (ton):

1600 ns

Maximum VCEsat:

1 V

Trade Compliance

BUV24 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-25-131-2638, 5961251312638

NIIN

251312638

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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