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BD802AK

Onsemi

BD802AK by Onsemi

The Onsemi BD802AK is a PNP BJT transistor with 100V VCE, 8A IC, and 15 min hFE. Ideal for amplifier applications, it has a max operating temperature of 150 °C. The package style is flange mount with through-hole terminals in a rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,830 parts In-Stock

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Vyrian

USA . 456 parts In-Stock

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456

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Native Components

USA . 341 parts In-Stock

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$0.807

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341

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Northwest PG Solutions

USA . 1,276 parts In-Stock

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$0.887

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$0.887

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TANS Electronics

Latvia . 7,279 parts In-Stock

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SupplyDigital Components

Austria . 4,326 parts In-Stock

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Corphita

USA . 2,486 parts In-Stock

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Kulean Microsystems

USA . 2,345 parts In-Stock

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Problanco Electronics

Mexico . 1,715 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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UHIMA Technologies

Türkiye . 90 parts In-Stock

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Overview

Unlock the power of innovation with the Onsemi BD802AK Power BJT. Designed with precision and quality by a trusted manufacturer, this transistor offers exceptional performance for amplifier applications. With a maximum collector-emitter voltage of 100V and a maximum collector current of 8A, this PNP transistor provides reliability and efficiency in a variety of electronic circuits. Experience the value and benefits of superior technology with the Onsemi BD802AK.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making the transistor suitable for a variety of applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in high-power applications and offer fast switching speeds, making them ideal for amplifier circuits.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making the transistor easier to use in amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier circuits, this transistor is optimized for high gain and low noise performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, ensuring reliable performance in demanding conditions.

Maximum Collector-Emitter Voltage: 100 V

The high collector-emitter voltage rating allows the transistor to handle higher voltages, making it suitable for a wide range of applications.

Maximum Collector Current (IC): 8 A

With a high collector current rating, this transistor can handle large currents, making it suitable for high-power applications.

Nominal Transition Frequency (fT): 3 MHz

The high transition frequency enables the transistor to operate at high frequencies, making it ideal for amplifier applications requiring fast switching speeds.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BD802AK attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

100 V

Configuration:

Minimum DC Current Gain (hFE):

15

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BD802AK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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