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AR0239SRSC00SUEA0-DRBR

Onsemi

AR0239SRSC00SUEA0-DRBR by Onsemi

Onsemi's AR0239SRSC00SUEA0-DRBR is a 3x3 um CMOS image sensor with 1936x1188 resolution. Featuring a 1/2.7 inch optical format, it offers 90 fps frame rate and surface mounting feature. Ideal for applications requiring high-speed imaging in compact devices like smartphones and action cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,876 parts In-Stock

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Flip Electronics

USA . 2,951 parts In-Stock

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Digiode

USA . 2,444 parts In-Stock

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Native Components

USA . 950 parts In-Stock

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$8.580

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Northwest PG Solutions

USA . 433 parts In-Stock

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$9.438

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$8.494

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AZTECH Wire

Italy . 193 parts In-Stock

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$13.350

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Kulean Microsystems

USA . 8,131 parts In-Stock

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Problanco Electronics

Mexico . 5,732 parts In-Stock

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SupplyDigital Components

Austria . 5,513 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,885 parts In-Stock

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Corphita

USA . 1,178 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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Corohmni

South Africa . 304 parts In-Stock

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Overview

Capture every moment with crystal-clear precision using the AR0239SRSC00SUEA0-DRBR image sensor by Onsemi. Known for their superior quality and cutting-edge technology, Onsemi has developed a game-changing product that is perfect for a wide range of applications. Whether you're in the automotive industry, security and surveillance, or consumer electronics, this image sensor offers unparalleled performance and reliability. With its high frame rate and advanced features, you can trust Onsemi to deliver exceptional value and benefits to meet all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 3X3

The small pixel size allows for high resolution and detailed image capture, making this sensor ideal for applications that require sharp and clear images.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption, making this product energy efficient and suitable for portable devices.

Horizontal Pixel: 1936

With a high horizontal pixel count, this sensor can capture wide-angle images with great detail and clarity, making it perfect for surveillance or panoramic photography.

Vertical Pixel: 1188

The vertical pixel count ensures that images captured with this sensor have sufficient depth and resolution, making it ideal for applications that require precise details.

Optical Format (inch): 1/2.7

The optical format of 1/2.7 inch provides a good balance between size and performance, making this sensor versatile and suitable for a wide range of imaging applications.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections, making this sensor durable and long-lasting in various operating conditions.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface allows for easy and efficient data transfer, making it convenient to integrate this sensor into different systems and devices.

Frame Rate: 90 fps

With a high frame rate of 90 fps, this sensor can capture fast-moving scenes with smooth and clear motion, making it suitable for applications that require real-time imaging.

Array Type: SINGLE FRAME

The single-frame array type simplifies the sensor's design and operation, making it cost-effective and reliable for imaging tasks that do not require multiple frames or complex setups.

Mounting Feature: SURFACE MOUNT

The surface mount configuration allows for easy and secure attachment to circuit boards or other surfaces, making this sensor convenient to install and use in compact devices or systems.

Technical Specifications

Image Sensors AR0239SRSC00SUEA0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER, PHASE-LOCKED LOOP

Array Type:

SINGLE FRAME

Frame Rate:

90 fps

Horizontal Pixel:

1936

Mounting Feature:

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Pixel Size (um):

3X3

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1188

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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