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AR0239SRSC00SUEA0-DR

Onsemi

AR0239SRSC00SUEA0-DR by Onsemi

Onsemi's AR0239SRSC00SUEA0-DR is a 1/2.7 inch CMOS image sensor with 1936x1188 resolution, 3x3 um pixel size, and 90 fps frame rate. It features Tin/Silver/Copper terminal finish, solder termination type, and a 2-wire interface. Ideal for applications requiring high-quality imaging in a compact form factor.

Median Price

$22.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$22.850

1k+ parts

$20.440

10k+ parts

$19.240

22

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$22.850

$20.440

$19.240

Distributors (In-Stock)

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Digiode

USA . 618 parts In-Stock

1+ parts

$25.327

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618

$25.327

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Vyrian

USA . 3,778 parts In-Stock

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Flip Electronics

USA . 22 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 625 parts In-Stock

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$12.560

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625

$12.560

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Corphita

USA . 1,026 parts In-Stock

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$23.994

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1,026

$23.994

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Corohmni

South Africa . 447 parts In-Stock

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$26.660

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447

$26.660

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Perfect Parts

USA . 15,053 parts In-Stock

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SupplyDigital Components

Austria . 7,494 parts In-Stock

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Problanco Electronics

Mexico . 5,863 parts In-Stock

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TANS Electronics

Latvia . 5,727 parts In-Stock

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Northwest PG Solutions

USA . 1,770 parts In-Stock

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1,770

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UHIMA Technologies

Türkiye . 802 parts In-Stock

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Native Components

USA . 781 parts In-Stock

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Kulean Microsystems

USA . 99 parts In-Stock

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Overview

Enhance your imaging projects with the AR0239SRSC00SUEA0-DR by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors like this one, perfect for applications ranging from security cameras to automotive systems. With its high resolution and fast frame rate, this sensor provides crisp, clear images without compromising speed. Trust Onsemi to provide reliable, cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the AR0239SRSC00SUEA0-DR today.

Feature Benefit Bullets

Pixel Size: 3X3 um

The small pixel size allows for high resolution images to be captured with great detail.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption and high quality image output, making this sensor a reliable choice for image capturing.

Horizontal Pixel: 1936

With a high number of horizontal pixels, this sensor can capture wide-angle shots with high clarity.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple finishes helps in better connectivity and durability of the sensor.

Vertical Pixel: 1188

The vertical pixels add depth to the captured images, enhancing the overall quality and detail.

Optical Format (inch): 1/2.7

The optical format determines the field of view and aspect ratio of the images captured, making this sensor suitable for various applications.

Termination Type: SOLDER

Solder termination ensures secure connections and reliable performance of the sensor.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connectivity of the sensor, making it easy to integrate with different devices.

Frame Rate: 90 fps

With a high frame rate, this sensor can capture fast-moving subjects with smooth motion and minimal blur.

Array Type: SINGLE FRAME

The single frame array simplifies the image processing and data transfer, making the sensor efficient and reliable.

Mounting Feature: SURFACE MOUNT

The surface mount design of the sensor allows for easy installation and integration into various electronic devices.

Technical Specifications

Image Sensors AR0239SRSC00SUEA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER, PHASE-LOCKED LOOP

Array Type:

SINGLE FRAME

Frame Rate:

90 fps

Horizontal Pixel:

1936

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Pixel Size (um):

3X3

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1188

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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