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AMIS42673ICAG1RG

Onsemi

AMIS42673ICAG1RG by Onsemi

AMIS42673ICAG1RG by Onsemi is a Network Interface IC with 8 terminals, operating at 5V. It has a data rate of 1 Mbps and is designed for automotive applications. The package style is small outline, with Gull Wing terminal form and a temperature range from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 11,401 parts In-Stock

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Digiode

USA . 1,822 parts In-Stock

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Inventory MP

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Bristol Electronics

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AZTECH Wire

Italy . 210 parts In-Stock

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$14.280

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Component Stockers USA

USA . 459 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 5,861 parts In-Stock

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SupplyDigital Components

Austria . 4,962 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 2,571 parts In-Stock

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TANS Electronics

Latvia . 2,293 parts In-Stock

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Corphita

USA . 1,728 parts In-Stock

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Native Components

USA . 597 parts In-Stock

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Northwest PG Solutions

USA . 494 parts In-Stock

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Microchip USA

USA . 464 parts In-Stock

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Corohmni

South Africa . 191 parts In-Stock

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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Overview

Enhance your network interfaces with the AMIS42673ICAG1RG by Onsemi, a top-quality product that offers unmatched reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this innovative device is ideal for a wide range of applications. With its compact design and advanced features, this interface circuit provides customers with exceptional value, seamless connectivity, and enhanced functionality. Upgrade your systems today with the AMIS42673ICAG1RG and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on printed circuit boards, saving time and effort.

Power Supplies (V): 5

The 5V power supply ensures compatibility with a wide range of devices and systems, offering flexibility in integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh conditions without compromising performance.

Data Rate: 1 Mbps

The 1 Mbps data rate allows for fast and efficient data transfer, making it suitable for applications requiring high-speed communication.

Technical Specifications

Network Interfaces AMIS42673ICAG1RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9276 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

AMIS42673ICAG1RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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