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2SB829R

Onsemi

2SB829R by Onsemi

The Onsemi 2SB829R is a PNP Power BJT with hFE of 100, VCE of 50V, and IC of 15A. Ideal for switching applications, it features a silicon element in a rectangular package with through-hole terminals. The transistor's flange mount style makes it suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Rochester

USA . 675 parts In-Stock

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675

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Vyrian

USA . 3,938 parts In-Stock

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Digiode

USA . 1,751 parts In-Stock

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GES GmbH

Germany . 4 parts In-Stock

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Native Components

USA . 110 parts In-Stock

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$0.400

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$0.384

110

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$0.384

Northwest PG Solutions

USA . 806 parts In-Stock

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$0.440

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$0.388

806

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$0.388

SupplyDigital Components

Austria . 7,080 parts In-Stock

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Problanco Electronics

Mexico . 7,047 parts In-Stock

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TANS Electronics

Latvia . 3,305 parts In-Stock

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Corphita

USA . 1,909 parts In-Stock

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Kulean Microsystems

USA . 1,741 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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UHIMA Technologies

Türkiye . 359 parts In-Stock

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Overview

Unleash the power of innovation with the 2SB829R by Onsemi. As a top-tier manufacturer in the industry, Onsemi guarantees superior quality and reliability in every product. The 2SB829R falls under the category of Power Bipolar Junction Transistors (BJT), making it ideal for a wide range of switching applications. With its PNP polarity, single configuration, and high DC current gain, this transistor offers unmatched performance and efficiency. Experience seamless operation and optimal functionality with the 2SB829R, designed to exceed expectations and deliver exceptional value to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: PNP

PNP transistors are efficient for switching applications and complementary to NPN transistors, providing design flexibility.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity in applications requiring only one transistor.

Transistor Application: SWITCHING

Designed for switching applications, ensuring fast response times and efficient performance in devices that require rapid on/off switching.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various electronic circuits and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable connections, ideal for applications that require secure transistor placement.

No. of Terminals: 3

Three terminals allow for easy connection and control of the transistor in circuits, offering versatility in circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style ensures stable and secure mounting of the transistor in electronic devices, reducing the risk of damage or disconnection.

Minimum DC Current Gain (hFE): 100

A minimum DC current gain of 100 indicates high amplification capability, allowing for efficient signal amplification in circuits.

Maximum Collector-Emitter Voltage: 50 V

With a maximum collector-emitter voltage of 50V, the transistor can handle moderate voltage levels in various applications without breakdown.

Transistor Element Material: SILICON

Silicon material offers high performance, reliability, and efficiency in transistor operation, ensuring stable and consistent electrical characteristics.

Maximum Collector Current (IC): 15 A

A maximum collector current of 15A allows the transistor to handle high current loads, making it suitable for power applications that require robust performance.

Terminal Finish: Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

The use of multiple terminal finishes ensures strong electrical connections, corrosion resistance, and compatibility with various soldering processes.

Terminal Position: SINGLE

Single terminal position simplifies soldering and connection processes, making the transistor easy to integrate into circuits and systems.

Nominal Transition Frequency (fT): 20 MHz

A nominal transition frequency of 20MHz indicates high-speed operation and switching capabilities, making the transistor efficient for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SB829R attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

100

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2SB829R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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