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2SB1203T-TL-H

Onsemi

2SB1203T-TL-H by Onsemi

Onsemi's 2SB1203T-TL-H is a NPN BJT transistor with VCEsat of 0.4V, IC of 5A, and hFE of 35. Ideal for switching applications, it has a max operating temp of 150 °C and fT of 180MHz. With GULL WING terminals in a SMALL OUTLINE package, it offers high power dissipation at 20W.

Median Price

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Lifecycle Status

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3

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1k+

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Chip Stock

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Native Components

USA . 768 parts In-Stock

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$0.880

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Northwest PG Solutions

USA . 1,131 parts In-Stock

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AZTECH Wire

Italy . 963 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 2,602 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 2,095 parts In-Stock

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TANS Electronics

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UHIMA Technologies

Türkiye . 451 parts In-Stock

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Corohmni

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Overview

Unlock the power of innovation with the Onsemi 2SB1203T-TL-H Power Bipolar Junction Transistor. Manufactured by industry leader Onsemi, this NPN transistor offers high performance and reliability for a variety of switching applications. With a maximum VCEsat of 0.4V and a maximum collector current of 5A, this transistor delivers efficient power dissipation and enhanced conductivity. Whether you're designing consumer electronics, automotive systems, or industrial automation, the 2SB1203T-TL-H provides the value and benefits you need to take your projects to the next level. Embrace cutting-edge technology and elevate your designs with Onsemi's top-of-the-line transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, offering versatility in design.

Configuration: SINGLE

The single configuration simplifies circuitry and makes it easier to integrate into designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such tasks.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB mounting, saving space in the overall design.

Maximum VCEsat: 0.4 V

Low VCEsat minimizes power loss and improves efficiency in switching applications.

Maximum Power Dissipation (Abs): 20 W

High power dissipation capability allows the transistor to handle demanding applications with reliability.

Maximum Collector-Base Capacitance: 40 pF

Low capacitance ensures fast response times and minimal signal distortion in high-frequency circuits.

Nominal Transition Frequency (fT): 180 MHz

High transition frequency allows for fast switching speeds and high-frequency operation.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SB1203T-TL-H attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

5 A

Maximum Collector-Base Capacitance:

40 pF

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

35

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

1 W

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.4 V

Trade Compliance

2SB1203T-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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