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2SB1166T

Onsemi

2SB1166T by Onsemi

Onsemi's 2SB1166T is a PNP BJT transistor with max. VCE of 50V and IC of 8A, ideal for switching applications. Featuring hFE of 200 and fT of 130MHz, it comes in a plastic/epoxy package with through-hole terminals. Suitable for various electronic circuits requiring high current switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,702 parts In-Stock

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Vyrian

USA . 85 parts In-Stock

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Native Components

USA . 754 parts In-Stock

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$0.195

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$0.187

754

$0.195

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$0.187

Northwest PG Solutions

USA . 1,363 parts In-Stock

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$0.215

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$0.189

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$0.215

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$0.189

Kulean Microsystems

USA . 5,289 parts In-Stock

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SupplyDigital Components

Austria . 4,167 parts In-Stock

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TANS Electronics

Latvia . 3,666 parts In-Stock

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Problanco Electronics

Mexico . 1,712 parts In-Stock

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Corphita

USA . 1,306 parts In-Stock

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UHIMA Technologies

Türkiye . 958 parts In-Stock

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Corohmni

South Africa . 479 parts In-Stock

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Overview

Unlock the power of reliable performance with the 2SB1166T by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and durability in their products, making the 2SB1166T an excellent choice for various switching applications. With a maximum collector current of 8A and a minimum DC current gain of 200, this PNP transistor offers exceptional value and efficiency. Trust Onsemi to deliver superior technology that meets your needs and exceeds your expectations. Upgrade your projects with the 2SB1166T and experience the difference in performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistors, making them suitable for a variety of environments.

Polarity or Channel Type: PNP

Allows for easy integration into circuits that require PNP transistors, expanding the compatibility of the product.

Minimum DC Current Gain (hFE): 200

High DC current gain ensures efficient and reliable performance in switching applications.

Maximum Collector-Emitter Voltage: 50 V

Allows for handling higher voltage levels, increasing the versatility of the transistors.

Maximum Collector Current (IC): 8 A

Capable of handling high current levels, making them suitable for applications that require power switching.

Nominal Transition Frequency (fT): 130 MHz

High transition frequency enables fast switching speeds, ensuring optimal performance in the switching applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SB1166T attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

200

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2SB1166T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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