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2SB1165T

Onsemi

2SB1165T by Onsemi

The Onsemi 2SB1165T is a PNP Power BJT with max. Vce of 50V and max. Ic of 5A, ideal for switching applications. Featuring hFE of 200 and fT of 130MHz, it's designed in a plastic/epoxy package with through-hole terminals for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 872 parts In-Stock

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Digiode

USA . 329 parts In-Stock

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329

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Native Components

USA . 471 parts In-Stock

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$0.548

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471

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Northwest PG Solutions

USA . 793 parts In-Stock

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$0.603

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SupplyDigital Components

Austria . 7,647 parts In-Stock

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Kulean Microsystems

USA . 6,246 parts In-Stock

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TANS Electronics

Latvia . 3,778 parts In-Stock

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Corphita

USA . 1,023 parts In-Stock

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Problanco Electronics

Mexico . 750 parts In-Stock

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750

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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Corohmni

South Africa . 199 parts In-Stock

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Overview

Unlock the power of high-quality and reliable performance with the 2SB1165T by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power Bipolar Junction Transistors (BJT) like no other. Ideal for switching applications, this PNP transistor offers a seamless experience with its single configuration and high DC current gain. With a maximum collector-emitter voltage of 50V and a maximum collector current of 5A, this transistor is perfect for a wide range of electronic projects. Trust Onsemi to provide superior quality and unmatched value with the 2SB1165T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: PNP

PNP transistors are suitable for applications where electron flow is predominant, making this transistor ideal for various switching applications.

Configuration: SINGLE

Simplifies the circuit design as only one transistor is required, reducing complexity and potential points of failure.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and reliability in tasks such as turning devices on and off.

Package Shape: RECTANGULAR

Facilitates easy placement and mounting on circuit boards, making it convenient for integration into electronic devices.

Terminal Form: THROUGH-HOLE

Enables secure soldering onto circuit boards, providing a stable connection for consistent performance.

No. of Terminals: 3

The three terminals allow for easy connection to external components, simplifying the circuit setup process.

Package Style (Meter): IN-LINE

The in-line package style saves space on the circuit board, making it suitable for compact electronic designs.

Minimum DC Current Gain (hFE): 200

High minimum DC current gain ensures amplification of input signals with minimal power loss, improving overall efficiency.

Maximum Collector-Emitter Voltage: 50 V

A high maximum collector-emitter voltage rating allows the transistor to handle higher voltages, increasing its versatility in various applications.

Transistor Element Material: SILICON

Silicon transistors offer better performance and reliability compared to other materials, ensuring consistent operation over time.

Maximum Collector Current (IC): 5 A

With a high maximum collector current rating, this transistor can handle larger currents, making it suitable for high-power applications.

Terminal Finish: TIN SILVER COPPER NICKEL

The high-quality terminal finish ensures good conductivity and corrosion resistance, maintaining a reliable connection over extended periods.

Terminal Position: SINGLE

A single terminal position simplifies the connection process, reducing the chances of errors during installation.

Nominal Transition Frequency (fT): 130 MHz

The high nominal transition frequency allows for fast switching speeds, making this transistor suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SB1165T attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

5 A

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

200

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e2

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2SB1165T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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