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MF1PLUS8011DUD/03

NXP Semiconductors

MF1PLUS8011DUD/03 by NXP Semiconductors

MF1PLUS8011DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,838

-

-

-

-

Vyrian

USA . 2,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,729

-

-

-

-

Anansix

USA . 988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

988

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,403 parts In-Stock

1+ parts

$15.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,403

$15.800

-

-

-

UNI Independent Distributors

Spain . 5,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,793

-

-

-

-

Corphita

USA . 2,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,757

-

-

-

-

Overview

Discover the MF1PLUS8011DUD/03 from NXP Semiconductors, where quality meets versatility! This innovative consumer IC enhances your applications with its reliable performance and robust design. Ideal for a range of uses, it ensures optimal functionality across varying temperatures. Trust in NXP's renowned expertise to deliver cutting-edge technology that elevates your projects, providing value, efficiency, and peace of mind for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB assembly, making this IC a great choice for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC ensures compatibility and performance in everyday electronic devices.

Package Style (Meter): UNCASED CHIP

The uncase chip form provides flexibility in custom PCB layouts and enables efficient thermal management.

Maximum Operating Temperature: 70 °C

Able to operate at higher temperatures, this component ensures reliability and longevity in warm environments.

Minimum Operating Temperature: -25 °C

With a low operating temperature threshold, this IC can function in cold environments, making it suitable for a wide range of applications.

Terminal Position: UPPER

The upper terminal position facilitates easier integration into designs, reducing manufacturing complexity.

Terminal Form: NO LEAD

The no-lead design enhances both the environmental profile of the product and simplifies the assembly process, aligning with modern manufacturing practices.

Technical Specifications

Other Function Consumer ICs MF1PLUS8011DUD/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MF1PLUS8011DUD/03 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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