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MF1PLUS6031DA4/03

NXP Semiconductors

MF1PLUS6031DA4/03 by NXP Semiconductors

MF1PLUS6031DA4/03 by NXP Semiconductors is a consumer IC designed for surface mount applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a microelectronic assembly package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,878 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,878

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Vyrian

USA . 4,745 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,745

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Anansix

USA . 1,485 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,485

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$15.890

100+ parts

-

1k+ parts

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10k+ parts

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253

$15.890

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One Stop Electronics

USA . 1,111 parts In-Stock

1+ parts

$20.800

100+ parts

-

1k+ parts

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10k+ parts

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1,111

$20.800

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UNI Independent Distributors

Spain . 6,175 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,175

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Corphita

USA . 2,649 parts In-Stock

1+ parts

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100+ parts

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2,649

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Overview

Unlock endless possibilities with the MF1PLUS6031DA4/03 from NXP Semiconductors, a leader in innovation and quality. This versatile consumer IC enhances your products with reliability and efficiency, ideal for diverse applications ranging from smart devices to advanced consumer electronics. Its robust design ensures peak performance in varying conditions, making it a smart investment for manufacturers seeking superior functionality and durability. Elevate your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides good protection against environmental factors, making this product suitable for a wide range of consumer applications.

Surface Mount: YES

The surface mount capability allows for compact designs and easier integration into circuit boards, enabling manufacturers to save space and reduce costs in production.

General IC Type: CONSUMER CIRCUIT

Being categorized as a consumer circuit IC indicates its tailored design for everyday applications, ensuring reliability and performance for general consumer electronic devices.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style allows for efficient heat dissipation and improved electrical performance, making it a great choice for modern electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can function reliably in a variety of environments, ensuring consistent performance without overheating.

Minimum Operating Temperature: -25 °C

The capability to operate down to -25 °C ensures that this product can be used in colder climates and applications, broadening its usability in consumer electronics.

Terminal Form: NO LEAD

The no-lead terminal form contributes to a smaller footprint and improved soldering process, further enhancing miniaturization in device design while maintaining strong electrical connections.

Technical Specifications

Other Function Consumer ICs MF1PLUS6031DA4/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS6031DA4/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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