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MF1PLUS8001DA4/13

NXP Semiconductors

MF1PLUS8001DA4/13 by NXP Semiconductors

MF1PLUS8001DA4/13 by NXP Semiconductors is a surface-mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features a no-lead terminal form, and comes in a microelectronic assembly package. Ideal for compact electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

-

-

-

-

Vyrian

USA . 429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

429

-

-

-

-

Digiode

USA . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

170

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,580 parts In-Stock

1+ parts

$16.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

$16.800

-

-

-

Corphita

USA . 4,639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,639

-

-

-

-

UNI Independent Distributors

Spain . 1,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,343

-

-

-

-

Overview

Elevate your projects with the MF1PLUS8001DA4/13 from NXP Semiconductors, a leader in innovative technology solutions. This high-quality consumer IC offers unmatched reliability and versatility, making it perfect for various applications—from smart devices to advanced security systems. With exceptional temperature resilience and seamless surface mount design, you’ll enjoy enhanced performance and efficiency, ensuring your products stand out in today’s competitive market. Experience innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and protection against environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being surface mount enables easier integration into compact designs and efficient assembly processes, ideal for modern electronics.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit, this IC is specifically designed for consumer electronics, ensuring reliability and performance in everyday devices.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style optimizes space and facilitates advanced manufacturing techniques, suitable for high-efficiency products.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can handle a wide range of use conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature: -25 °C

A minimum operating temperature of -25 °C allows this IC to be used in colder environments, broadening its application range.

Terminal Form: NO LEAD

The no lead terminal form helps reduce space requirements while minimizing the risk of damage during handling, ideal for modern PCB layouts.

Technical Specifications

Other Function Consumer ICs MF1PLUS8001DA4/13 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS8001DA4/13 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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