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MF1PLUS6001DA4/13

NXP Semiconductors

MF1PLUS6001DA4/13 by NXP Semiconductors

MF1PLUS6001DA4/13 by NXP Semiconductors is a consumer circuit IC designed for surface mount applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a microelectronic assembly package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,484

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-

-

-

Vyrian

USA . 3,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,012

-

-

-

-

Anansix

USA . 981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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981

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,519 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,519

$6.800

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UNI Independent Distributors

Spain . 5,058 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,058

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Corphita

USA . 4,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,972

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-

-

-

Overview

Experience the reliability and innovation of the MF1PLUS6001DA4/13 from NXP Semiconductors, a leader in consumer ICs. This versatile component is designed for seamless integration in various applications, delivering exceptional performance in challenging environments. With its robust construction and superior thermal stability, it ensures longevity and efficiency, allowing you to enhance your products while reducing costs. Elevate your designs and drive success with NXP's unparalleled quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures a robust product suitable for various consumer applications, providing excellent protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design and facilitates automated assembly, making it easy to integrate into modern electronic devices while saving space on the PCB.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC meets the needs of a wide range of electronic devices, ensuring reliable performance and user satisfaction.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style enhances the IC's functionality by allowing for advanced electrical connections, enabling efficient performance in small form factors.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can perform reliably in moderate thermal conditions, making it suitable for consumer electronics used in various environments.

Minimum Operating Temperature: -25 °C

The ability to operate in low temperatures down to -25 °C allows this IC to function effectively in colder regions or conditions, broadening its potential applications.

Terminal Form: NO LEAD

The no-lead terminal form design enhances electrical performance and minimizes the footprint on the PCB, leading to better thermal management and improved reliability.

Technical Specifications

Other Function Consumer ICs MF1PLUS6001DA4/13 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS6001DA4/13 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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